Laser beam induced thermal-crack propagation for asymmetric linear cutting of silicon wafer

2019 ◽  
Vol 120 ◽  
pp. 105765 ◽  
Author(s):  
Xiaoliang Cheng ◽  
Lijun Yang ◽  
Maolu Wang ◽  
Yecheng Cai ◽  
Yang Wang ◽  
...  
2012 ◽  
Vol 628 ◽  
pp. 211-216 ◽  
Author(s):  
C.Y. Zhao ◽  
Hong Zhi Zhang ◽  
Y. Wang

Laser molten cutting silicon wafer was focused more recently, but this method has the material loss disadvantage. So this paper indicates the finite element simulation and experiments of cutting silicon wafer with YAG laser induced thermal-crack propagation. A theoretical model of a thermal laser shock method for separation of the silicon wafer is developed, and the fracture propagation mechanism is studied by the stress fields using finite element software ABAQUS. Optical microscope and laser scan confocal microscope (LSCM) photographs of the separation surface and path are obtained to examine the cutting quality. The impact of technological parameters on the cutting quality is studied and the optimum processing parameters are presented in the paper.


2014 ◽  
Vol 711 ◽  
pp. 222-226
Author(s):  
Chun Yang Zhao ◽  
Hong Zhi Zhang ◽  
Li Jun Yang ◽  
Yang Wang

In laser induced thermal crack propagation (LITP) cutting brittle materials, according to the laser absorption ability, materials are divided into the body absorption and surface absorption. This paper indicates the fracture mechanism of LITP cutting surface absorption brittle materials. The crack extension appears in the lower surface firstly in this stress distribution state, then the crack extends to the upper surface and the laser scanning direction with the LITP cutting. The stress field of cutting ZrO2 ceramic is studied by finite element software ANSYS. The crack propagation process of cutting silicon wafer is studied by finite element software ABAQUS. According to the fracture mechanism, the curve cutting the ZrO2 ceramic experiments and the cooling lower surface cutting the silicon wafer experiments are carried out in this paper. Optical microscope and laser scan confocal microscope (LSCM) photographs of the curve path the ZrO2 ceramic and separation surface cutting the silicon wafer are obtained to examine the cutting quality. The quality of the curve path is very good. The quality of the separation surface in cutting the silicon wafer with the cooling lower surface is better than conventional environment.


2019 ◽  
Vol 125 (7) ◽  
Author(s):  
Xiaoliang Cheng ◽  
Lijun Yang ◽  
Maolu Wang ◽  
Yecheng Cai ◽  
Yang Wang ◽  
...  

2020 ◽  
Vol 2020 ◽  
pp. 1-17
Author(s):  
Fei Wang ◽  
Yu’e Ma ◽  
Yanning Guo ◽  
Wei Huang

Peridynamic (PD) theory is used to study the thermally induced cracking behavior of functionally graded materials (FGMs). A modified thermomechanical peridynamic model is developed. The thermal crack propagation of a ceramic slab in quenching is calculated to validate the modified PD model. The results predicted by the modified PD model agree with previously published numerical and experimental ones. Compared with the original PD model, the calculation accuracy of the modified PD model for thermal cracking is improved. The thermal cracking in FGMs is also simulated. The effects of material shape, initial temperature, and ceramic fracture toughness on thermal crack propagation behaviors are studied. It can be found that the thermal cracks in FGMs are still in periodical and hierarchical forms. The metal materials in FGMs can prevent crack initiation and arrest the long cracks. The crack number tends to be increased with the increasing initial temperature, while the strengthened ceramic fracture toughness can decrease it.


2014 ◽  
Vol 783-786 ◽  
pp. 2310-2315 ◽  
Author(s):  
Nikolai Kashaev ◽  
Stefan Riekehr ◽  
Manfred Horstmann ◽  
Volker Ventzke

Weight reduction is the main driving force in automotive and aircraft structural design. As a result, magnesium alloys, with their high potential for lightweight construction, have attracted a considerable amount of industrial attention. The determining criterion for the structural applications of magnesium alloys is the availability of efficient joining technologies for the construction of lightweight structures and the availability of reliable data for the assessment of their damage tolerance behaviour. Laser beam welding (LBW), as a high-speed and easily controllable process, allows the welding of complex geometric forms that are optimised in terms of mechanical stiffness, strength, production velocity and visual quality. The work accomplished in this study addresses the challenges of the LBW process for typical joint configurations using the magnesium alloy AZ31HP: butt joints, T joints and overlap joints. LBW processes were developed for use with a 3.3-kW Nd:YAG laser to optimise the mechanical performance of such joints with respect to tensile strength, fatigue, fatigue crack propagation and mechanical fracture behaviour. The relationships between the LBW process and the microstructural and mechanical properties of welds were established. Compared to state-of-the-art aerospace alloys, AZ31HP demonstrates that magnesium alloys have potential for use in structural applications, with AZ31HP being comparable to AA2024T351 and AA6061T6. Welded AZ31HP exhibits better crack resistance than the base material, so fully welded integral structures made from magnesium alloys can be used in lightweight construction.


Author(s):  
Kuk Tae Youn ◽  
Young Mok Rhyim ◽  
Jong Hoon Lee ◽  
Chan Gyu Lee ◽  
Dong Bae Kim ◽  
...  

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