scholarly journals Simulation Analysis of Mimosa Pudica Main Pulvinus Towards Biological Tactile Sensing Modelling

2015 ◽  
Vol 76 ◽  
pp. 425-429 ◽  
Author(s):  
Siti Nora Basir ◽  
Hanafiah Yussof ◽  
Nur Ismarrubie Zahari
Keyword(s):  
Simulation Analysis ◽  
Tactile Sensing ◽  
Mimosa Pudica ◽  
Main Pulvinus

scholarly journals Adaptive anatomical structure for nastic movement in Mimosa pudica L.

2013 ◽  
Vol 42 (1) ◽  
pp. 131-138
Author(s):  
Ming-Lin Chen ◽  
Wen-Bin Mao ◽  
Mei-Chen Cui
Keyword(s):  
Anatomical Structure ◽  
Mimosa Pudica ◽  
Anatomical Structures ◽  
Albizia Julibrissin ◽  
Cortical Parenchyma ◽  
Parenchyma Cells ◽  
Protoplast Volume ◽  
Main Pulvinus

In order to study the adaptive anatomical structures during nastic movement of Mimosa pudica L., anatomical structures of main pulvinus, common petioles, rachis and leaflets were compared with Albizia julibrissin Durazz. (taken as control). The anatomical structures of main pulvinus and common petiole of M. pudica were different from that of A. julibrissin. Upon stimuliti, the protoplast volume of M. pudica in the lower cortical parenchyma cells become smaller than that in upper ones, a feature seldom found in A. julibrissin. There were found many reticulate lacunas on the two side of adaxial petiole of M. pudica, but nil in A. julibrissin. Similarly some ill developed lacunas were found in the pulvinus of rachis and leaflet of M. pudica, but absent in A. julibrissin. It appears that reticulate lacunas in common petiole of M. pudica are responsible for its strong nastic movement. The main sensitivity position lies at the base of common petiole, where the lower cortex is more sensitive than the upper cortex, and the ordinal sensitivity positions are rachis and leaflets. DOI: http://dx.doi.org/10.3329/bjb.v42i1.15876 Bangladesh J. Bot. 42(1): 131-137, 2013 (June)

scholarly journals A Model on the Main Pulvinus Movement of Mimosa Pudica.

2000 ◽  
Vol 43 (4) ◽  
pp. 923-928 ◽  
Author(s):  
Hiroyuki KAGAWA ◽  
Eiji SAITO
Keyword(s):  
Mimosa Pudica ◽  
Pulvinus Movement ◽  
Main Pulvinus

Computer simulation study about the dependence of amorphous silicon photonic waveguides efficiency on the material quality

2020 ◽  
Vol 90 (3) ◽  
pp. 30502
Author(s):  
Alessandro Fantoni ◽  
João Costa ◽  
Paulo Lourenço ◽  
Manuela Vieira
Keyword(s):  
Amorphous Silicon ◽  
High Throughput Screening ◽  
Simulation Analysis ◽  
Low Cost ◽  
Deposition Process ◽  
Large Area ◽  
Sidewall Roughness ◽  
Sensing Applications ◽  
Fabrication Defects ◽  
The Impact

Amorphous silicon PECVD photonic integrated devices are promising candidates for low cost sensing applications. This manuscript reports a simulation analysis about the impact on the overall efficiency caused by the lithography imperfections in the deposition process. The tolerance to the fabrication defects of a photonic sensor based on surface plasmonic resonance is analysed. The simulations are performed with FDTD and BPM algorithms. The device is a plasmonic interferometer composed by an a-Si:H waveguide covered by a thin gold layer. The sensing analysis is performed by equally splitting the input light into two arms, allowing the sensor to be calibrated by its reference arm. Two different 1 × 2 power splitter configurations are presented: a directional coupler and a multimode interference splitter. The waveguide sidewall roughness is considered as the major negative effect caused by deposition imperfections. The simulation results show that plasmonic effects can be excited in the interferometric waveguide structure, allowing a sensing device with enough sensitivity to support the functioning of a bio sensor for high throughput screening. In addition, the good tolerance to the waveguide wall roughness, points out the PECVD deposition technique as reliable method for the overall sensor system to be produced in a low-cost system. The large area deposition of photonics structures, allowed by the PECVD method, can be explored to design a multiplexed system for analysis of multiple biomarkers to further increase the tolerance to fabrication defects.

Sign in / Sign up

Export Citation Format

Share Document