High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging
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2019 ◽
Vol 9
(5)
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pp. 854-863
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2014 ◽
Vol 161
(9)
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pp. D395-D404
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2015 ◽
Vol 30
(5)
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pp. 2456-2464
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1997 ◽
Vol 82
(6)
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pp. 567-574
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