Effect of mechanical compliance of mounting clamp on electrical properties and vibration response of high-frequency piezoelectric ultrasonic transducer for microelectronic packaging and interconnection
Keyword(s):
2009 ◽
Vol 79-82
◽
pp. 1727-1730
◽
2013 ◽
Vol 121
(1416)
◽
pp. 670-674
◽