Cold drawn gold wires are widely applied in electronic packaging process to interconnect
micro-electronic components. They basically provides a conducting path for electronic signal
transfer, and experience thermo-mechanical loads in use. The mechanical stability of drawn gold
wires is a matter of practical concern in the reliable functioning of electronic devices. It is known that
mechanical properties of materials are deeply related to the microstructure. With appropriate control
of deformation and heat processes, the mechanical properties of final products, such as tensile
strength and elongation can be improved. Severe plastic deformation by torsion usually contributes to
grain refinement and increment of strength. In this study, microstructure variations with torsion strain
followed by drawing and heat treatment were investigated. Analyses by focused ion beam (FIB) and
electron backscattered diffraction (EBSD) were carried out to characterize the effect of deformation
and heat treatment on the drawn gold wires. Pattern quality of EBSD measurements was used as a
quantitative measure for plastic deformation.
Redox Cycling Realized in Paper-Based Electrochemical Biosensor for Highly-Selective Detection of Potassium Ferrocyanide in the Presence of Ascorbic Acid
