Novel silicone–phenyl contained amine curing agent for epoxy resin: 1. Non-isothermal cure and thermal decomposition
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2013 ◽
Vol 815
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pp. 547-551
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1986 ◽
Vol 11
(2)
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pp. 79-93
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2007 ◽
Vol 139
(1)
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pp. 105-113
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2014 ◽
Vol 15
(3)
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pp. 100-108
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