An Evaluation of Low-Cycle Fatigue Property for Sn-3.5Ag and Sn-0.7Cu Lead-Free Solders Using Surface Deformation

2006 ◽  
Vol 326-328 ◽  
pp. 1035-1038 ◽  
Author(s):  
Takehiko Takahashi ◽  
Susumu Hioki ◽  
Ikuo Shohji ◽  
Osamu Kamiya
Keyword(s):  
Fatigue Life ◽  
Surface Deformation ◽  
Fatigue Testing ◽  
Low Cycle Fatigue ◽  
Fatigue Behavior ◽  
Fatigue Property ◽  
Lead Free ◽  
Cycle Fatigue ◽  
Lead Free Solders ◽  
The Relationship

The low-cycle fatigue behavior and the relationship between the surface features in the low-cycle fatigue testing and the fatigue life of Sn-3.5Ag and Sn-0.7Cu lead-free solders were investigated at strain rate of 0.1%/s at room temperature, 80 and 120oC. In addition, the fatigue life was estimated by using the surface deformation of the solders, and image processing. And also, it was compared with Coffin-Manson type of fatigue behavior. The fatigue life of Sn-3.5Ag solder was superior to that of Sn-0.7Cu solder at temperatures, 80 and 120oC. The fatigue life determined by surface deformation indicated a close behavior to Coffin-Manson type fatigue behavior in those solders. Therefore the low-cycle fatigue life of solders could be estimated by the surface deformation.

An Evaluation of Fatigue Damage in Low-Cycle Range for Sn-3.5Ag, Sn-0.7Cu Lead-Free Solders and Sn-Pb Eutectic Solder Using Image Processing to Surface Feature

2005 ◽  
Author(s):  
Takehiko Takahashi ◽  
Susumu Hioki ◽  
Ikuo Shohji ◽  
Osamu Kamiya
Keyword(s):  
Image Processing ◽  
Fatigue Life ◽  
Fatigue Test ◽  
Surface Deformation ◽  
Low Cycle Fatigue ◽  
Fatigue Behavior ◽  
Lead Free ◽  
Cycle Fatigue ◽  
Surface Features ◽  
Lead Free Solders

The low-cycle fatigue behavior of Sn-3.5mass%Ag, Sn-0.7mass%Cu lead-free solders and Sn-37mass%Pb solder were investigated at strain rate of 0.1%/s with a non-contact extensometer at room temperature (22 ± 3 °C). In addition, the relationship between the surface features in the low-cycle fatigue test and the fatigue life of those solders were investigated by image processing. The fatigue lives of Sn-3.5mass%Ag and Sn-0.7mass%Cu were better than that of Sn-37mass%Pb. The low-cycle fatigue behavior on each solder followed Coffin-Manson equation. The surface deformation in fine wrinkles was observed in the low-cycle fatigue test at each solder. The surface features for each solder were evaluated by image processing from the surface deformation. The surface features in the low-cycle fatigue test did not appear until under 10% of the fatigue life for Sn-3.5mass%Ag, until 10% of the fatigue life for Sn-0.7mass%Cu, and until 20% of the fatigue life for Sn-37mass%Pb.

Low Cycle Fatigue Behavior and Surface Feature by Image Processing of Sn-0.7Cu Lead-Free Solder

2006 ◽  
Vol 306-308 ◽  
pp. 115-120 ◽  
Author(s):  
Takehiko Takahashi ◽  
Susumu Hioki ◽  
Ikuo Shohji ◽  
Osamu Kamiya
Keyword(s):  
Fatigue Life ◽  
Fatigue Test ◽  
Surface Deformation ◽  
Low Cycle Fatigue ◽  
Fatigue Behavior ◽  
Surface Feature ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cycle Fatigue ◽  
Free Solder

The low-cycle fatigue behavior on Sn-0.7Cu lead-free solder as-cast and Sn-Pb eutectic solder as-cast were investigated at a strain rate 0.1%/s under various temperatures of 25, 80 and 120oC. In addition, the relationships between the surface feature in the low-cycle fatigue test and low-cycle fatigue life of those solders at 25oC were investigated by image processing. The low-cycle fatigue life of Sn-0.7Cu decreased when the temperature increased. And the fatigue life of Sn-0.7Cu was better than that of the Sn-Pb eutectic solder at the temperatures of 25 and 80oC. The low-cycle fatigue behavior on the solders investigated followed Coffin-Manson equation. The fatigue ductility coefficient of Sn-0.7Cu was found to be affected by the temperature. The surface deformation as fine meshes in the low-cycle fatigue test of Sn-0.7Cu did not appear until 10% of the fatigue life. Although it was over 10% of the fatigue life, the surface deformation that was caused by micro cracks and coalesces occurred with the increasing number of cycles. The relationships between the surface feature in the low-cycle fatigue test and the low-cycle fatigue life on Sn-0.7Cu and Sn-37Pb solders were discussed.

Low Cycle Fatigue Test of Lead Free Solders Using Small Sized Specimen

2017 ◽  
Vol 734 ◽  
pp. 194-201 ◽  
Author(s):  
Yutaka Konishi ◽  
Takamoto Itoh ◽  
Masao Sakane ◽  
Fumio Ogawa ◽  
Hideyuki Kanayama
Keyword(s):  
Fatigue Testing ◽  
Low Cycle Fatigue ◽  
Testing Machine ◽  
Strain Range ◽  
Fatigue Tests ◽  
Lead Free ◽  
Cycle Fatigue ◽  
Bulk Specimen ◽  
Free Solder ◽  
Lead Free Solders

This paper investigates the fatigue results in low cycle fatigue region obtained from a miniaturized specimen having a 6mm gage length, 3mm diameter and 55mm total length. Fatigue tests were performed for two type lead-free solders using horizontal-type electrical servo hydraulic push-pull fatigue testing machine. Materials employed were Sn-3.0Ag-0.5Cu and Sn-5Sb. The results from Sn-3.0Ag-0.5Cu were compared with those obtained using a bulk specimen in a previous study. Relationship between strain range and number of cycles to failure of the small-sized specimen agreed with those of the bulk specimens. The testing techniques are applicable to Sn-5Sb following the Manson-Coffin law. These results confirm that the testing technique proposed here, using small-sized specimen, is suitable to get fruitful fatigue data for lead-free solder compounds.

Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders

2002 ◽  
Vol 31 (5) ◽  
pp. 456-465 ◽  
Author(s):  
Chaosuan Kanchanomai ◽  
Yukio Miyashita ◽  
Yoshiharu Mutoh
Keyword(s):  
Low Cycle Fatigue ◽  
Fatigue Behavior ◽  
Lead Free ◽  
Cycle Fatigue ◽  
Lead Free Solders

Low Cycle Fatigue Behavior of CP-Ti at Different Temperatures

2019 ◽  
Vol 795 ◽  
pp. 29-34
Author(s):  
Tian Hao Ma ◽  
Le Chang ◽  
Chang Yu Zhou
Keyword(s):  
Fatigue Life ◽  
Low Cycle Fatigue ◽  
Fatigue Behavior ◽  
Fatigue Cracks ◽  
Cyclic Softening ◽  
Cycle Fatigue ◽  
Different Temperatures ◽  
Cp Ti ◽  
The Relationship ◽  
Life Prediction Model

Low cycle fatigue (LCF) tests are performed on CP-Tiat different temperatures (293K,423K and 523K). It is found that the fatigue life of CP-Tidecreases with temperature. A short cycle hardening phenomenon occurs at the beginning of cyclic deformationat 293K and 423K, followed by cyclic softening untilfailure. At 523K, cycle hardening isexhibited throughout the entire cycle until thefracture. The fatigue-life curves obtained from the tests are constructed using Coffin-Manson-Basquin model. According to the relationship between the four parameters of Coffin-Manson-Basquin model and temperature, the temperature-based life prediction model is further proposed. Scanning electron microscopy observation of fatigue fractures showsthat the fatigue cracks of CP-Tiat 423K and 523K under different strain amplitudes initiate on the surface of fatigue specimens and extend to the fracture zone by the transgranular mode.

scholarly journals Fatigue Testing of Wearable Sensing Technologies: Issues and Opportunities

Materials ◽  
2021 ◽  
Vol 14 (15) ◽  
pp. 4070
Author(s):  
Andrea Karen Persons ◽  
John E. Ball ◽  
Charles Freeman ◽  
David M. Macias ◽  
Chartrisa LaShan Simpson ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Prediction Models ◽  
Fatigue Testing ◽  
Low Cycle Fatigue ◽  
Wearable Sensors ◽  
Fatigue Tests ◽  
Proof Of Concept ◽  
Cycle Fatigue ◽  
Wearable Sensing ◽  
Failure Data

Standards for the fatigue testing of wearable sensing technologies are lacking. The majority of published fatigue tests for wearable sensors are performed on proof-of-concept stretch sensors fabricated from a variety of materials. Due to their flexibility and stretchability, polymers are often used in the fabrication of wearable sensors. Other materials, including textiles, carbon nanotubes, graphene, and conductive metals or inks, may be used in conjunction with polymers to fabricate wearable sensors. Depending on the combination of the materials used, the fatigue behaviors of wearable sensors can vary. Additionally, fatigue testing methodologies for the sensors also vary, with most tests focusing only on the low-cycle fatigue (LCF) regime, and few sensors are cycled until failure or runout are achieved. Fatigue life predictions of wearable sensors are also lacking. These issues make direct comparisons of wearable sensors difficult. To facilitate direct comparisons of wearable sensors and to move proof-of-concept sensors from “bench to bedside,” fatigue testing standards should be established. Further, both high-cycle fatigue (HCF) and failure data are needed to determine the appropriateness in the use, modification, development, and validation of fatigue life prediction models and to further the understanding of how cracks initiate and propagate in wearable sensing technologies.

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