Investigation of thermal stability of Mo thin-films as the buffer layer and various Cu metallization as interconnection materials for thin film transistor–liquid crystal display applications
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2016 ◽
Vol 63
(11)
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pp. 4320-4325
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2014 ◽
Vol 23
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1992 ◽
Vol 36
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pp. 3-10
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2021 ◽
Vol 9
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pp. 130
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2020 ◽
Vol 258
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pp. 120587
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Vol 38
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pp. 992-1007
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2015 ◽
Vol 80
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pp. 201-211
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