Investigation of thermal stability of Mo thin-films as the buffer layer and various Cu metallization as interconnection materials for thin film transistor–liquid crystal display applications

2007 ◽  
Vol 515 (18) ◽  
pp. 7209-7216 ◽  
Author(s):  
Yee-Wen Yen ◽  
Yu-Lin Kuo ◽  
Jian-Yu Chen ◽  
Chiapyng Lee ◽  
Chung-Yu Lee
2020 ◽  
Vol 258 ◽  
pp. 120587 ◽  
Author(s):  
Hau-Ming Chang ◽  
Shiao-Shing Chen ◽  
Zhi-Sheng Cai ◽  
Wen-Shing Chang ◽  
Saikat Sinha Ray ◽  
...  

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