Discrete Kirchhoff–Love shell quadrilateral finite element designed from cubic Hermite edge curves and Coons surface patch

2021 ◽  
Vol 168 ◽  
pp. 108268
Author(s):  
Tomo Veldin ◽  
Boštjan Brank ◽  
Miha Brojan
2015 ◽  
Vol 8 (4) ◽  
pp. 582-604
Author(s):  
Zhengqin Yu ◽  
Xiaoping Xie

AbstractThis paper proposes and analyzes semi-discrete and fully discrete hybrid stress finite element methods for elastodynamic problems. A hybrid stress quadrilateral finite element approximation is used in the space directions. A second-order center difference is adopted in the time direction for the fully discrete scheme. Error estimates of the two schemes, as well as a stability result for the fully discrete scheme, are derived. Numerical experiments are done to verify the theoretical results.


2013 ◽  
Vol 2013 ◽  
pp. 1-12 ◽  
Author(s):  
Jeong-Hoon Song ◽  
Thomas Menouillard ◽  
Alireza Tabarraei

A numerical method for dynamic failure analysis through the phantom node method is further developed. A distinct feature of this method is the use of the phantom nodes with a newly developed correction force scheme. Through this improved approach, fracture energy can be smoothly dissipated during dynamic failure processes without emanating noisy artifact stress waves. This method is implemented to the standard 4-node quadrilateral finite element; a single quadrature rule is employed with an hourglass control scheme in order to decrease computational cost and circumvent difficulties associated with the subdomain integration schemes for cracked elements. The effectiveness and robustness of this method are demonstrated with several numerical examples. In these examples, we showed the effectiveness of the described correction force scheme along with the applicability of this method to an interesting class of structural dynamic failure problems.


1995 ◽  
Vol 19 (3) ◽  
pp. 195-207 ◽  
Author(s):  
Jian-Wu Zhang ◽  
Wilfried B. Kratzig

VLSI Design ◽  
1998 ◽  
Vol 6 (1-4) ◽  
pp. 127-130
Author(s):  
S. Babiker ◽  
A. Asenov ◽  
J. R. Barker ◽  
S. P. Beaumont

The complex recess and gate shape of modem compound FETs greatly affect the device parasitics and therefore impose the need for proper description of the device geometry and surface conditions in any practical device simulations. In this paper we describe a new Monte Carlo (MC) module incorporated in our Heterojunction 2D Finite element FET simulator H2F [1]. The module combines realistic quadrilateral finite-element description of the device geometry with realistic particle simulation of the non-equilibrium hot carrier transport in short recess gate compound FETs. A Single Programme Multiple Data (SPMD) parallel approach makes it possible to use our MC simulator for practical design work, generating the necessary I-V characteristics in parallel. The capabilities of the finite element MC module are illustrated in example simulations of a 200nm pseudomorphic HEMT fabricated in the Nanoelectronics Research Centre of Glasgow University.


2010 ◽  
Vol 160-162 ◽  
pp. 81-86
Author(s):  
Feng Liu

The three dimensional finite element model of composite laminates made of carbon fiber reinforced bismaleimide resin is built, and the stress state of the composite laminates under unidirectional tensile force is analyzed. The strength criterion and damage mode are given based on the stresses of material principal direction. The three dimensional finite element models of the same laminates with non-penetrating damage repaired by two kinds of bonding methods are built. The strength criterion and the damage mode of the two kinds of repaired models are also given. The influence of the interlaminar stress is considered in these analysis models. It is showed that the three dimensional models can simulate the geometric and physical features of the real composite laminates. It is concluded that the original composite laminates and the repaired ones both damage first in the laminar whose second material principal direction coincides with the axial tensile force. The damage mode is resin crack under tensile stress. The strength of the bonding patches is higher than the mother laminates. After scarf bonding repair, the strength of the damaged laminates recovers up to about eighty-four percent. With additional surface patch, the strength of the damaged laminates recovers up to about eighty-nine percent. Surface patch can improve the strength of damaged laminates.


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