Damage detection technique using ultrasonic guided waves and outlier detection: Application to interface delamination diagnosis of integrated circuit package
2021 ◽
Vol 160
◽
pp. 107884
Keyword(s):
Keyword(s):
2015 ◽
Vol 23
(2)
◽
pp. 369-391
◽
Keyword(s):
2012 ◽
Vol 525-526
◽
pp. 433-436
2009 ◽
Vol 417-418
◽
pp. 357-360
◽