Preparation of iron oxide thin film by metal organic deposition from Fe(III)-acetylacetonate: a study of photocatalytic properties

2000 ◽  
Vol 379 (1-2) ◽  
pp. 83-88 ◽  
Author(s):  
Bonamali Pal ◽  
Maheshwar Sharon
Keyword(s):  
Thin Film ◽  
Iron Oxide ◽  
Photocatalytic Properties ◽  
Oxide Thin Film ◽  
Metal Organic ◽  
Metal Organic Deposition

Thermally Annealed Iron (Oxide) Thin Film on an Alumina Barrier Layer, by XPS

2013 ◽  
Vol 20 (1) ◽  
pp. 55-61 ◽  
Author(s):  
Nitesh Madaan ◽  
Supriya S. Kanyal ◽  
David S. Jensen ◽  
Michael A. Vail ◽  
Andrew E. Dadson ◽  
...  
Keyword(s):  
Thin Film ◽  
Iron Oxide ◽  
Barrier Layer ◽  
Oxide Thin Film

scholarly journals Stress mechanism of Y1-xGdxBCO thin film with Gd substitution prepared by F-free metal organic deposition method

2017 ◽  
Vol 66 (15) ◽  
pp. 156101
Author(s):  
Chen Zhen-Ni ◽  
Liu Sheng-Li ◽  
Wang Hai-Yun ◽  
Cheng Jie
Keyword(s):  
Thin Film ◽  
Deposition Method ◽  
Metal Organic ◽  
Metal Organic Deposition ◽  
Free Metal

PMODTM-based Direct Thin Film Imaging, DTFITM, on Flexible Substrates

2003 ◽  
Vol 769 ◽  
Author(s):  
Paul J. Roman ◽  
Harold O. Madsen ◽  
Seigi Suh ◽  
Leo G. Svendsen ◽  
Shyama P. Mukherjee ◽  
...  
Keyword(s):  
Thin Film ◽  
Organic Films ◽  
Flexible Substrates ◽  
Mask Pattern ◽  
Plastic Substrates ◽  
Hard Mask ◽  
Metal Organic ◽  
Imaging Methodology ◽  
Metal Organic Deposition ◽  
Sidewall Angle

AbstractPMOD (Photochemical Metal Organic Deposition)-based DTFI (Direct Thin Film Imaging) methodology is a demonstrated means for patterning organic materials on flexible (plastic) substrates. This process is used to pattern 1-micron features at an aspect ratio of 8:1 using contact lithography. Use of oxygen plasma RIE etch to transfer the hard mask pattern to the organic material allows for good sidewall angle control. High etch selectivity between the novolac polymer and PMOD TiOX hard mask (< 800:1) makes the use of very thin hard masks (∼ 200 angstroms) to pattern thick organic films (<10 microns) possible. Selective removal of the PMOD TiOX (TiO2) hard mask makes this process amenable to patterning of functional organic structures fabricated from materials chosen for their desired properties (e.g., glass transition temperature (Tg), etch resisitance, optical properties, mechanical properties, etc.) not their ability to be photopatterned (e.g., photoresist).

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