The variation of dislocation density as a function of the stacking fault energy in shock-deformed FCC materials

2002 ◽  
Vol 328 (1-2) ◽  
pp. 256-266 ◽  
Author(s):  
A. Rohatgi ◽  
K.S. Vecchio
Keyword(s):  
Dislocation Density ◽  
Stacking Fault ◽  
Stacking Fault Energy ◽  
Fcc Materials

scholarly journals Hot Wear of Single Phase fcc Materials—Influence of Temperature, Alloy Composition and Stacking Fault Energy

Metals ◽  
2021 ◽  
Vol 11 (12) ◽  
pp. 2062
Author(s):  
Aaron Berger ◽  
Maximilian Walter ◽  
Santiago Manuel Benito ◽  
Sebastian Weber
Keyword(s):  
Single Phase ◽  
Elevated Temperatures ◽  
Electron Backscatter Diffraction ◽  
Wear Behavior ◽  
Industrial Applications ◽  
Stacking Fault ◽  
Stacking Fault Energy ◽  
Austenitic Steels ◽  
Microstructural Parameters ◽  
Fcc Materials

The severe sliding abrasion of single-phase metallic materials is a complex issue with a gaining importance in industrial applications. Different materials with different lattice structures react distinctly to stresses, as the material reaction to wear of counter and base body is mainly determined by the deformation behavior of the base body. For this reason, fcc materials in particular are investigated in this work because, as shown in previous studies, they exhibit better hot wear behavior than bcc materials. In particular, three austenitic steels are investigated, with pure Ni as well as Ni20Cr also being studied as benchmark materials. This allows correlations to be worked out between the hot wear of the material and their microstructural parameters. For this reason, wear tests are carried out, which are analyzed on the basis of the wear characteristics and scratch marks using Electron Backscatter Diffraction. X-ray experiments at elevated temperatures were also carried out to determine the microstructural parameters. It was found that the stacking fault energy, which influences the strain hardening potential, governs the hot wear behavior at elevated temperatures. These correlations can be underlined by analysis of the wear affected cross section, where the investigated materials have shown clear differences.

scholarly journals Characterization of Dislocation Rearrangement in FCC Metals during Work Hardening Using X-ray Diffraction Line-Profile Analysis

2020 ◽  
Vol 4 (4) ◽  
pp. 36
Author(s):  
Koutarou Nakagawa ◽  
Momoki Hayashi ◽  
Kozue Takano-Satoh ◽  
Hirotaka Matsunaga ◽  
Hiroyuki Mori ◽  
...  
Keyword(s):  
Grain Size ◽  
Dislocation Density ◽  
Line Profile ◽  
Cell Walls ◽  
Tensile Deformation ◽  
Profile Analysis ◽  
Stacking Fault ◽  
Stacking Fault Energy ◽  
Line Profile Analysis ◽  
Fcc Metals

Multiplication and rearrangement of dislocations in face-centered cubic (FCC) metals during tensile deformation are affected by grain size, stacking fault energy (SFE), and solute elements. X-ray diffraction (XRD) line-profile analysis can evaluate the dislocation density (ρ) and dislocation arrangement (M) from the strength of the interaction between dislocations. However, the relationship between M and ρ has not been thoroughly addressed. In this study, multiplication and rearrangement of dislocations in FCC metals during tensile deformation was evaluated by XRD line-profile analysis. Furthermore, the effects of grain size, SFE, and solute elements on the extent of dislocation rearrangement were evaluated with varying M values during tensile deformation. M decreased as the dislocation density increased. By contrast, grain size and SFE did not exhibit a significant influence on the obtained M values. The influence of solute species and concentration of solute elements on M changes were also determined. In addition, the relationship between dislocation substructures and M for tensile deformed metals were also explained. Dislocations were loosely distributed at M > 1, and cell walls gradually formed by gathering dislocations at M < 1. While cell walls became thicker with decreasing M in metals with low stacking fault energy, thin cell walls with high dislocation density formed for an M value of 0.3 in metals with high stacking fault energy.

Mechanical milling-induced deformation twinning in Fcc materials with high stacking fault energy

2003 ◽  
Vol 34 (3) ◽  
pp. 707-712 ◽  
Author(s):  
Jianhong He ◽  
Kyung H. Chung ◽  
Enrique J. Lavernia ◽  
Xiaozhou Liao ◽  
Yuntian T. Zhu
Keyword(s):  
Mechanical Milling ◽  
Deformation Twinning ◽  
Stacking Fault ◽  
Stacking Fault Energy ◽  
Fcc Materials
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