Intrinsic stress evolution in diamond films prepared in a CH4H2NH3 hot filament chemical vapor deposition system

Thin diamond film coated WC-Co cutting tool inserts were produced using arc-jet and hot-filament chemical vapor deposition. The diamond films were characterized using SEM, XRD, and Raman spectroscopy to examine crystal structure, fracture mode, thickness, crystalline orientation, diamond quality, and residual stress. The performance of the tools was evaluated by comparing the wear resistance of the materials to brazed polycrystalline diamond-tipped cutting tool inserts (PCD) while machining A390 aluminum (18% silicon). Results from the experiments carried out in this study suggest that the wear resistance of the thin diamond films is primarily related to the grain boundary strength, crystal orientation, and the density of microdefects in the diamond film.

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Fabrication of smooth diamond films on SiO2 by the addition of nitrogen to the gas feed in hot-filament chemical vapor deposition

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films ◽

10.1116/1.1340657 ◽

2001 ◽

Vol 19 (4) ◽

pp. 1052-1056 ◽

Cited By ~ 1

Author(s):

Vitor Baranauskas ◽

Alfredo C. Peterlevitz ◽

Zhao Jingguo ◽

Steven F. Durrant

Keyword(s):

Chemical Vapor Deposition ◽

Vapor Deposition ◽

Diamond Films ◽

Chemical Vapor ◽

Hot Filament

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Mechanical properties and wear behavior of multi-layer diamond films deposited by hot-filament chemical vapor deposition

Applied Surface Science ◽

10.1016/j.apsusc.2019.07.110 ◽

2019 ◽

Vol 494 ◽

pp. 401-411 ◽

Cited By ~ 1

Author(s):

Guangyu Yan ◽

Yuhou Wu ◽

Daniel Cristea ◽

Lusheng Liu ◽

Mircea Tierean ◽

...

Keyword(s):

Mechanical Properties ◽

Chemical Vapor Deposition ◽

Vapor Deposition ◽

Wear Behavior ◽

Diamond Films ◽

Chemical Vapor ◽

Hot Filament

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A study on the residual stress measurement methods on chemical vapor deposition diamond films

Journal of Materials Research ◽

10.1557/jmr.1998.0414 ◽

1998 ◽

Vol 13 (11) ◽

pp. 3027-3033 ◽

Cited By ~ 15

Author(s):

Jung Geun Kim ◽

Jin Yu

Keyword(s):

Residual Stress ◽

Chemical Vapor Deposition ◽

Tensile Stress ◽

Residual Stresses ◽

Vapor Deposition ◽

Diamond Films ◽

Chemical Vapor ◽

Peak Shift ◽

Intrinsic Stress ◽

Chemical Vapor Deposition Diamond

Diamond films were deposited on the p-type Si substrate with the hot filament chemical vapor deposition (HFCVD). Residual stresses in the films were measured in air by the laser curvature, the x-ray diffraction (XRD) dϕψ − sin2ψ, and the Raman peak shift methods. All of the measuring methods showed similar behaviors of residual stress that changed from a compressive to a tensile stress with increasing the film thickness. However, values of residual stresses obtained through the Raman and XRD methods were 3–4 times higher than those of the curvature method. These discrepancies involved the setting of materials constants of CVD diamond film, and determination of a peak shifting on the XRD and Raman method. In order to elucidate the disparity, we measured a Young's moduli of diamond films by using the sonic resonance method. In doing so, the Raman and XRD peak shift were calibrated by bending diamond/Si beams with diamond films by a known amount, with stress levels known a priori from the beam theory, and by monitoring the peak shifts simultaneously. Results of each measuring method showed well coincidental behaviors of residual stresses which have the stress range from −0.5 GPa to +0.7 GPa, and an intrinsic stress was caused about +0.7 GPa with tensile stress.

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