Microstructural evolution during semisolid processing of Al–Si–Cu alloy with different Mg contents

2017 ◽  
Vol 27 (7) ◽  
pp. 1483-1497 ◽  
Author(s):  
K.S. ALHAWARI ◽  
M.Z. OMAR ◽  
M.J. GHAZALI ◽  
M.S. SALLEH ◽  
M.N. MOHAMMED
1999 ◽  
Vol 5 (2) ◽  
pp. 141-147 ◽  
Author(s):  
Jongsang Lee ◽  
Eon-Sik Lee ◽  
W. J. Park ◽  
J. Y. Jung ◽  
S. Ahn ◽  
...  

2017 ◽  
Vol 898 ◽  
pp. 1020-1025
Author(s):  
Fei Cao ◽  
Fen Fen Yang ◽  
Xue Jian Wang ◽  
Hui Jun Kang ◽  
Ya Nan Fu ◽  
...  

Synchrotron X-ray radiography was used to in situ study the diffusion behavior and microstructural evolution of Al/Cu bimetal. The interface diffusion, dendritic/eutectic growth and the formation of intermetallic compounds around the Al/Cu bimetal interface were analyzed. During the isothermal diffusion process, a liquefied transition zone at the interface with a concentration gradient was formed when the Cu concentration exceeded eutectic composition of Al-Cu alloy. During the solidification of transition zone, the growth sequence of α-Al dendrites and eutectic structure were mainly dominated by the variation of Cu concentration and thermal field according to the temperature of the liquidus line of the equilibrium phase diagram. Finally, the transition zone around the interface were identified to be I (α-Al), II (Al+Al2Cu), III (Al2Cu) and IV (Al2Cu, AlCu and Al4Cu9), respectively.


2010 ◽  
Vol 45 (17) ◽  
pp. 4621-4630 ◽  
Author(s):  
Zhi Chao Duan ◽  
Xiao Zhou Liao ◽  
Megumi Kawasaki ◽  
Roberto B. Figueiredo ◽  
Terence G. Langdon

2010 ◽  
Vol 527 (18-19) ◽  
pp. 4742-4749 ◽  
Author(s):  
G. Sha ◽  
Y.B. Wang ◽  
X.Z. Liao ◽  
Z.C. Duan ◽  
S.P. Ringer ◽  
...  

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