1073 Long-pulse versus short-pulse laser lithotripsy performance

The aim of our study was to obtain similar surface properties and elemental composition to virgin implants after debridement of contaminated titanium implant surfaces covered with debris. Erbium-doped:yttrium, aluminum, and garnet (Er:YAG) laser, erbium, chromium-doped:yttrium, scandium, gallium, and garnet (Er,Cr:YSGG) laser, curette, and ultrasonic device were applied to contaminated implant surfaces. Scanning electron microscopy (SEM) images were taken, the elemental profile of the surfaces was evaluated with energy dispersive X-ray spectroscopy (EDX), and the surface roughness was analyzed with profilometry. Twenty-eight failed implants and two virgin implants as control were included in the study. The groups were designed accordingly; titanium curette group, ultrasonic scaler with polyetheretherketone (PEEK) tip, Er: YAG very short pulse laser group (100 μs, 120 mJ/pulse 10 Hz), Er: YAG short-pulse laser group (300 μs, 120 mJ/pulse, 10 Hz), Er: YAG long-pulse laser group (600 μs, 120 mJ/pulse, 10 Hz), Er, Cr: YSGG1 laser group (1 W 10 Hz), Er, Cr: YSGG2 laser group (1.5 W, 30 Hz). In each group, four failed implants were debrided for 120 s. When SEM images and EDX findings and profilometry results were evaluated together, Er: YAG long pulse and ultrasonic groups were found to be the most effective for debridement. Furthermore, the two interventions have shown the closest topography of the sandblasted, large grit, acid-etched implant surface (SLA) as seen on virgin implants.

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Ablation of Subsurface Tumors Using 1552 nm Ultra-Short Pulse Laser

ASME 2008 Summer Bioengineering Conference, Parts A and B ◽

10.1115/sbc2008-192415 ◽

2008 ◽

Author(s):

Shreya Raje ◽

Amir Sajjadi ◽

Kunal Mitra ◽

Michael S. Grace

Keyword(s):

Laser Beam ◽

Pulse Laser ◽

Continuous Wave ◽

Short Pulse ◽

Laser Source ◽

Short Pulse Laser ◽

Fiber Optic Probes ◽

Laser Immunotherapy ◽

Ultra Short Pulse ◽

Long Pulse

Over last two decades lasers have been used for the treatment of subsurface tumors. Various techniques such as Laser-induced Hyperthermia, Laser Interstitial Thermal Therapy (LITT), and Laser Immunotherapy have been developed for the successful ablation of subsurface tumors by different researchers. All these techniques use photo-thermal mechanism for tumor ablation by delivering thermal energy at the tumor site. In all these existing techniques, either continuous wave (CW) or long pulse laser source has been used, which often produces larger heat affected zone as compared to that produced by short pulse laser. Moreover, the delivery of laser beam at the target site is achieved through fiber optic probes which often require perforation of the skin. These drawbacks can be eliminated if a converging laser beam from a short pulse laser source is directly focused at the subsurface location to ablate the tumor.

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Inline process analysis and control using optical measurement for the ultra-short pulse laser ablation of CAD designed microstructures

International Congress on Applications of Lasers & Electro-Optics ◽

10.2351/1.5063164 ◽

2015 ◽

Author(s):

Marco Smarra ◽

Jens Hildenhagen ◽

Klaus Dickmann

Keyword(s):

Laser Ablation ◽

Pulse Laser ◽

Pulse Laser Ablation ◽

Optical Measurement ◽

Short Pulse ◽

Process Analysis ◽

Short Pulse Laser ◽

Ultra Short Pulse ◽

And Control ◽

Ultra Short Pulse Laser

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Ultra-Short Pulse Laser Ablation of Biological Hard Tissue and Biocompatibles

Journal of Laser Micro/Nanoengineering ◽

10.2961/jlmn.2008.01.0007 ◽

2008 ◽

Vol 3 (1) ◽

pp. 30-40 ◽

Cited By ~ 16

Author(s):

Martin Strassl

Keyword(s):

Laser Ablation ◽

Pulse Laser ◽

Pulse Laser Ablation ◽

Short Pulse ◽

Hard Tissue ◽

Short Pulse Laser ◽

Ultra Short Pulse ◽

Ultra Short Pulse Laser

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Silicon Thinning using Ultra-Short Pulse Laser Ablation

ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2004p0552 ◽

2004 ◽

Author(s):

F. Beaudoin ◽

P. Perdu ◽

C. DeNardi ◽

R. Desplats ◽

J. Lopez ◽

...

Keyword(s):

Laser Ablation ◽

Sample Preparation ◽

Pulse Laser ◽

Pulse Laser Ablation ◽

Short Pulse ◽

Special Care ◽

Short Pulse Laser ◽

Ultra Short Pulse ◽

Ultra Short Pulse Laser

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.

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