In Situ Inkjet Printing of the Perovskite Single-Crystal Array-Embedded Polydimethylsiloxane Film for Wearable Light-Emitting Devices

2020 ◽  
Vol 12 (19) ◽  
pp. 22157-22162 ◽  
Author(s):  
Zhenkun Gu ◽  
Zhandong Huang ◽  
Xiaotian Hu ◽  
Ying Wang ◽  
Lihong Li ◽  
...  
2021 ◽  
Vol 93 ◽  
pp. 106168
Author(s):  
Chunbo Zheng ◽  
Xin Zheng ◽  
Chen Feng ◽  
Songman Ju ◽  
Zhongwei Xu ◽  
...  

RSC Advances ◽  
2020 ◽  
Vol 10 (3) ◽  
pp. 1281-1286 ◽  
Author(s):  
Fei Lian ◽  
Chuanxi Wang ◽  
Qian Wu ◽  
Minghui Yang ◽  
Zhenyu Wang ◽  
...  

Stretchable, mechanically stable multi-color carbon-dots-based polymer films are in situ fabricated, and showed potential for application in optoelectronic devices.


2005 ◽  
Vol 483-485 ◽  
pp. 1051-1056
Author(s):  
A. Krost ◽  
Armin Dadgar ◽  
F. Schulze ◽  
R. Clos ◽  
K. Haberland ◽  
...  

Due to the lack of GaN wafers, so far, group-III nitrides are mostly grown on sapphire or SiC substrates. Silicon offers an attractive alternative because of its low cost, large wafer area, and physical benefits such as the possibility of chemical etching, lower hardness, good thermal conductivity, and electrical conducting or isolating for light emitting devices or transistor structures, respectively. However, for a long time, a technological breakthrough of GaN-on-silicon has been thought to be impossible because of the cracking problem originating in the huge difference of the thermal expansion coefficients between GaN and silicon which leads to tensile strain and cracking of the layers when cooling down. However, in recent years, several approaches to prevent cracking and wafer bowing have been successfully applied. Nowadays, device-relevant thicknesses of crackfree group-III-nitrides can be grown on silicon. To reach this goal the most important issues were the identification of the physical origin of strains and its engineering by means of in situ monitoring during metalorganic vapor phase epitaxy.


1997 ◽  
Vol 488 ◽  
Author(s):  
N. Koch ◽  
L.-M. Yu ◽  
J.-L. Guyaux ◽  
Y. Morciaux ◽  
G. Leising ◽  
...  

AbstractBlue light emitting devices (LED) with para-hexaphenyl (PHP) as the active material and aluminum as cathode exhibit very high quantum efficiencies. To further optimize device performance it is crucial to understand the physical properties of the involved interfaces. We have performed Rutherford-Backscattering experiments on actual devices to show the importance of oxygen in the interface formation at the cathode as this leads to the formation of a layer of AlxOy between PHP and aluminum. In devices, where the organic film is exposed to air before the metal electrode is evaporated, an insulating layer on the metal-side therefore is inherent. It has been shown that the introduction of an intermediate layer between active material and electrodes results in a higher quantum efficiency of the LED, the most common concepts being charge-transport-layers, or insulators on the other hand. Our results underline the need for a better control of the LED processing. Ultraviolet- and X-ray photoelectron spectroscopy in situ growth studies of thin aluminum films on PHP have been made to reveal the change in the electronic structure of the active medium in a LED in the absence of oxygen. Also the direct interaction of oxygen with this organic material is investigated by photoelectron spectroscopy.


2017 ◽  
Vol 29 (2) ◽  
pp. 022602 ◽  
Author(s):  
Wojtek J. Walecki ◽  
Peter S. Walecki ◽  
Eve S. Walecki ◽  
Abigail S. Walecki

2020 ◽  
Vol 5 (6) ◽  
pp. 2000099 ◽  
Author(s):  
Danyang Li ◽  
Junjie Wang ◽  
Miaozi Li ◽  
Gancheng Xie ◽  
Biao Guo ◽  
...  

MRS Advances ◽  
2017 ◽  
Vol 2 (53) ◽  
pp. 3129-3133
Author(s):  
Wojtek J. Walecki ◽  
Peter S. Walecki ◽  
Eve S. Walecki ◽  
Abigail S. Walecki

ABSTRACTNovel metrology tool for in-situ characterization of surfaces semiconductor solar cells (both silicon and compound), and Light Emitting Device diffusers is presented. The tool measures the total integrated scattering when measuring forward, or back-reflection at very large angles of incidence. The tool is insensitive to vibrations and stray light. We discuss polarization resolved data and characterize our technique using NIST traceable standards. We discuss it’s applications to semiconductor manufacturing.


2017 ◽  
Vol 27 (13) ◽  
pp. 1604659 ◽  
Author(s):  
Ran Ding ◽  
Jing Feng ◽  
Feng-Xi Dong ◽  
Wei Zhou ◽  
Yang Liu ◽  
...  

2015 ◽  
Vol 61 (10) ◽  
pp. 1135-1140
Author(s):  
Jing FENG ◽  
Ran DING ◽  
Wei ZHOU ◽  
FengXi DONG

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