Highly Thermally Conductive Graphene-Based Thermal Interface Materials with a Bilayer Structure for Central Processing Unit Cooling

2021 ◽  
Author(s):  
Zhi-Guo Wang ◽  
Jia-Cheng Lv ◽  
Zi-Li Zheng ◽  
Ji-Guang Du ◽  
Kun Dai ◽  
...  
Keyword(s):  
Central Processing Unit ◽  
Thermal Interface Materials ◽  
Processing Unit ◽  
Bilayer Structure ◽  
Thermal Interface ◽  
Central Processing ◽  
Thermally Conductive ◽  
Interface Materials

scholarly journals Ball-Milled Recycled Lead-Graphite Pencils as Highly Stretchable and Low-Cost Thermal-Interface Materials

Polymers ◽  
2018 ◽  
Vol 10 (7) ◽  
pp. 799 ◽  
Author(s):  
Chun-An Liao ◽  
Yee-Kwan Kwan ◽  
Tien-Chan Chang ◽  
Yiin-Kuen Fuh
Keyword(s):  
Low Cost ◽  
Exfoliated Graphite ◽  
Thermal Interface Materials ◽  
Graphite Nanoplatelets ◽  
Thermal Interface ◽  
Thermally Conductive ◽  
Highly Stretchable ◽  
Exfoliated Graphite Nanoplatelets ◽  
Interface Materials ◽  
Thermal Conductivities

A simple and sustainable production of nanoplatelet graphite at low cost is presented using carbon-based materials, including the recycled lead-graphite pencils. In this work, exfoliated graphite nanoplatelets (EGNs), ball-milled exfoliated graphite nanoplatelets (BMEGNs) and recycled lead-graphite pencils (recycled 2B), as well as thermally cured polydimethylsiloxane (PDMS), are used to fabricate highly stretchable thermal-interface materials (TIMs) with good thermally conductive and mechanically robust properties. Several characterization techniques including scanning electron microscopy (SEM) and thermogravimetric analysis (TGA) showed that recycled nanoplatelet graphite with lateral size of tens of micrometers can be reliably produced. Experimentally, the thermal conductivity was measured for EGNs, BMEGNs and recycled 2B fillers with/without the effect of ball milling. The in-plane thermal conductivities of 12.97 W/mK (EGN), 13.53 W/mK (recycled 2B) and 14.56 W/mK (BMEGN) and through-plane thermal conductivities of 0.76 W/mK (EGN), 0.84 W/mK (recycled 2B) and 0.95 W/mK (BMEGN) were experimentally measured. Anisotropies were calculated as 15.31, 15.98 and 16.95 for EGN, recycled 2B and BMEGN, respectively. In addition, the mechanical robustness of the developed TIMs is such that they are capable of repeatedly bending at 180 degrees with outstanding flexibility, including the low-cost renewable material of recycled lead-graphite pencils. For heat dissipating application in high-power electronics, the TIMs of recycled 2B are capable of effectively reducing temperatures to approximately 6.2 °C as favorably compared with thermal grease alone.

scholarly journals Globular Flower-Like Reduced Graphene Oxide Design for Enhancing Thermally Conductive Properties of Silicone-Based Spherical Alumina Composites

Nanomaterials ◽  
2020 ◽  
Vol 10 (3) ◽  
pp. 544
Author(s):  
Weijie Liang ◽  
Tiehu Li ◽  
Xiaocong Zhou ◽  
Xin Ge ◽  
Xunjun Chen ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Graphene Oxide ◽  
Reduced Graphene Oxide ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Reduced Graphene ◽  
The Matrix ◽  
Thermally Conductive ◽  
Interface Materials ◽  
Spherical Alumina

The enhancement of thermally conductive performances for lightweight thermal interface materials is a long-term effort. The superb micro-structures of the thermal conductivity enhancer have an important impact on increasing thermal conductivity and decreasing thermal resistance. Here, globular flower-like reduced graphene oxide (GFRGO) is designed by the self-assembly of reduced graphene oxide (RGO) sheets, under the assistance of a binder via the spray-assisted method for silicone-based spherical alumina (S-Al2O3) composites. When the total filler content is fixed at 84 wt%, silicone-based S-Al2O3 composites with 1 wt% of GFRGO exhibit a much more significant increase in thermal conductivity, reduction in thermal resistance and reinforcement in thermal management capability than that of without graphene. Meanwhile, GFRGO is obviously superior to that of their RGO counterparts. Compared with RGO sheets, GFRGO spheres which are well-distributed between the S-Al2O3 fillers and well-dispersed in the matrix can build three-dimensional and isotropic thermally conductive networks more effectively with S-Al2O3 in the matrix, and this minimizes the thermal boundary resistance among components, owning to its structural characteristics. As with RGO, the introduction of GFRGO is helpful when decreasing the density of silicone-based S-Al2O3 composites. These attractive results suggest that the strategy opens new opportunities for fabricating practical, high-performance and light-weight filler-type thermal interface materials.

Metal-Level Thermally Conductive yet Soft Graphene Thermal Interface Materials

ACS Nano ◽  
2019 ◽  
Vol 13 (10) ◽  
pp. 11561-11571 ◽  
Author(s):  
Wen Dai ◽  
Tengfei Ma ◽  
Qingwei Yan ◽  
Jingyao Gao ◽  
Xue Tan ◽  
...  
Keyword(s):  
Metal Level ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Thermally Conductive ◽  
Interface Materials

Advanced Thermal Interface Materials for Thermal Management

2018 ◽  
Author(s):  
Wei Yu ◽  
◽  
Changqing Liu ◽  
Lin Qiu ◽  
Ping Zhang ◽  
...  
Keyword(s):  
Thermal Management ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Materials

Perangkat keras komputer

2020 ◽  
Author(s):  
Roudati jannah
Keyword(s):  
Data Storage ◽  
Central Processing Unit ◽  
External Memory ◽  
Storage Device ◽  
Input Device ◽  
Processing Unit ◽  
Central Processing ◽  
Output Device

Perangkat keras komputer adalah bagian dari sistem komputer sebagai perangkat yang dapat diraba, dilihat secara fisik, dan bertindak untuk menjalankan instruksi dari perangkat lunak (software). Perangkat keras komputer juga disebut dengan hardware. Hardware berperan secara menyeluruh terhadap kinerja suatu sistem komputer. Prinsipnya sistem komputer selalu memiliki perangkat keras masukan (input/input device system) – perangkat keras premprosesan (processing/central processing unit) – perangkat keras luaran (output/output device system) – perangkat tambahan yang sifatnya opsional (peripheral) dan tempat penyimpanan data (storage device system/external memory).

CENTRAL PROCESSING UNIT (CPU)

2020 ◽  
Author(s):  
Ika Milia wahyunu Siregar
Keyword(s):  
Processing System ◽  
Central Processing Unit ◽  
Processing Unit ◽  
Central Processing

Perkembangan IT di dunia sangat pesat, mulai dari perkembangan sofware hingga hardware. Teknologi sekarang telah mendominasi sebagian besar di permukaan bumi ini. Karena semakin cepatnya perkembangan Teknologi, kita sebagai pengguna bisa ketinggalan informasi mengenai teknologi baru apabila kita tidak up to date dalam pengetahuan teknologi ini. Hal itu dapat membuat kita mudah tergiur dan tertipu dengan berbagai iklan teknologi tanpa memikirkan sisi negatifnya. Sebagai pengguna dari komputer, kita sebaiknya tahu seputar mengenai komponen-komponen komputer. Komputer adalah serangkaian mesin elektronik yang terdiri dari jutaan komponen yang dapat saling bekerja sama, serta membentuk sebuah sistem kerja yang rapi dan teliti. Sistem ini kemudian digunakan untuk dapat melaksanakan pekerjaan secara otomatis, berdasarkan instruksi (program) yang diberikan kepadanya. Istilah Hardware komputer atau perangkat keras komputer, merupakan benda yang secara fisik dapat dipegang, dipindahkan dan dilihat. Central Processing System/ Central Processing Unit (CPU) adalah salah satu jenis perangkat keras yang berfungsi sebagai tempat untuk pengolahan data atau juga dapat dikatakan sebagai otak dari segala aktivitas pengolahan seperti penghitungan, pengurutan, pencarian, penulisan, pembacaan dan sebagainya.

Sign in / Sign up

Export Citation Format

Share Document