Highly Anisotropic Thermal Conductivity of Layer-by-Layer Assembled Nanofibrillated Cellulose/Graphene Nanosheets Hybrid Films for Thermal Management

2017 ◽  
Vol 9 (3) ◽  
pp. 2924-2932 ◽  
Author(s):  
Na Song ◽  
Dejin Jiao ◽  
Siqi Cui ◽  
Xingshuang Hou ◽  
Peng Ding ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Graphene Nanosheets ◽  
Nanofibrillated Cellulose ◽  
Layer By Layer ◽  
Hybrid Films ◽  
Anisotropic Thermal Conductivity

scholarly journals High-Performance Thermal Management Nanocomposites: Silver Functionalized Graphene Nanosheets and Multiwalled Carbon Nanotube

Crystals ◽  
2018 ◽  
Vol 8 (11) ◽  
pp. 398 ◽  
Author(s):  
Yongcun Zhou ◽  
Xiao Zhuang ◽  
Feixiang Wu ◽  
Feng Liu
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotube ◽  
Polymer Composites ◽  
Thermal Management ◽  
High Performance ◽  
Graphene Nanosheets ◽  
Multiwalled Carbon Nanotube ◽  
Processing Unit ◽  
Functionalized Graphene ◽  
Multiwalled Carbon

Polymer composites with high thermal conductivity have a great potential for applications in modern electronics due to their low cost, easy process, and stable physical and chemical properties. Nevertheless, most polymer composites commonly possess unsatisfactory thermal conductivity, primarily because of the high interfacial thermal resistance between inorganic fillers. Herein, we developed a novel method through silver functionalized graphene nanosheets (GNS) and multiwalled carbon nanotube (MWCNT) composites with excellent thermal properties to meet the requirements of thermal management. The effects of composites on interfacial structure and properties of the composites were identified, and the microstructures and properties of the composites were studied as a function of the volume fraction of fillers. An ultrahigh thermal conductivity of 12.3 W/mK for polymer matrix composites was obtained, which is an approximate enhancement of 69.1 times compared to the polyvinyl alcohol (PVA) matrix. Moreover, these composites showed more competitive thermal conductivities compared to untreated fillers/PVA composites applied to the desktop central processing unit, making these composites a high-performance alternative to be used for thermal management.

Incorporating Ag Nanowires into Graphene Nanosheets for Enhanced Thermal Conductivity: Implications for Thermal Management

2020 ◽  
Vol 3 (6) ◽  
pp. 6061-6070
Author(s):  
Ya Li ◽  
Xu Li ◽  
Md Mofasserul Alam ◽  
Dongbo Yu ◽  
Jibin Miao ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Graphene Nanosheets ◽  
Ag Nanowires ◽  
Enhanced Thermal Conductivity

scholarly journals BN Nanosheet/Polymer Films with Highly Anisotropic Thermal Conductivity for Thermal Management Applications

2017 ◽  
Vol 9 (49) ◽  
pp. 43163-43170 ◽  
Author(s):  
Yuanpeng Wu ◽  
Ye Xue ◽  
Si Qin ◽  
Dan Liu ◽  
Xuebin Wang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Polymer Films ◽  
Anisotropic Thermal Conductivity

Anisotropic thermally conductive flexible films based on nanofibrillated cellulose and aligned graphene nanosheets

2016 ◽  
Vol 4 (2) ◽  
pp. 305-314 ◽  
Author(s):  
Na Song ◽  
Dejin Jiao ◽  
Peng Ding ◽  
Siqi Cui ◽  
Shengfu Tang ◽  
...  
Keyword(s):  
Graphene Nanosheets ◽  
Nanofibrillated Cellulose ◽  
Hybrid Films ◽  
Graphene Nanosheet ◽  
Flexible Films ◽  
Thermally Conductive ◽  
Thermal Conductivities

The nanofibrillated cellulose/graphene nanosheet hybrid films possessed significantly anisotropic thermal conductivities. The anisotropy originated from the alignment of graphene nanosheets, which can lead to different thermal resistances along the in-plane and through-plane directions.

scholarly journals High-Performance Thermal Management Nanocomposites: Silver Functionalized Graphene Nanosheets and Multiwalled Carbon Nanotube

2018 ◽  
Author(s):  
Yongcun Zhou ◽  
Xiao Zhuang ◽  
Feixiang Wu ◽  
Feng Liu
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotube ◽  
Polymer Composites ◽  
Thermal Management ◽  
High Performance ◽  
Graphene Nanosheets ◽  
Multiwalled Carbon Nanotube ◽  
Processing Unit ◽  
Functionalized Graphene ◽  
Multiwalled Carbon

Polymer composites with high thermal conductivity have a great potential for applications in modern electronics due to their low cost, easy process, and stable physical and chemical properties. Nevertheless, most polymer composites commonly possess unsatisfactory thermal conductivity, primarily because of the high interfacial thermal resistance between inorganic fillers. Herein, we developed a novel method through silver functionalized graphene nanosheets (GNS) and multiwalled carbon nanotube (MWCNT) composites with excellent thermal properties to meet the requirements of thermal management. The effects of composites on interfacial structure and properties of the composites were identified, and the microstructures and properties of the composites were studied as a function of the volume fraction of fillers. An ultrahigh thermal conductivity of 12.3 W/mK for polymer matrix composites was obtained, which is an approximate enhancement of 69.1 times compared to the polyvinyl alcohol (PVA) matrix. Moreover, these composites showed more competitive thermal conductivities compared to untreated fillers/PVA composites applied to the desktop central processing unit, making these composites a high-performance alternative to be used for thermal management.

Thermal conductivity from hierarchical heat sinks using carbon nanotubes and graphene nanosheets

Nanoscale ◽  
2015 ◽  
Vol 7 (44) ◽  
pp. 18663-18670 ◽  
Author(s):  
Chien-Te Hsieh ◽  
Cheng-En Lee ◽  
Yu-Fu Chen ◽  
Jeng-Kuei Chang ◽  
Hsi-sheng Teng
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Electrical Conductivity ◽  
Thermal Management ◽  
Graphene Nanosheets ◽  
Consumer Electronics ◽  
Experimental Results ◽  
Heat Sinks ◽  
Empirical Equations ◽  
The Relationship

The relationship between thermal conductivity (k) and electrical conductivity (ε) values was well described by two empirical equations. The experimental results were obtained within the 323–373 K range, suitably complementing the thermal management of chips for consumer electronics.

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