Fabrication of Thermal Conductivity Enhanced Polymer Composites by Constructing an Oriented Three-Dimensional Staggered Interconnected Network of Boron Nitride Platelets and Carbon Nanotubes

2018 ◽  
Vol 10 (42) ◽  
pp. 36342-36351 ◽  
Author(s):  
Zheng Su ◽  
Hua Wang ◽  
Jing He ◽  
Yulan Guo ◽  
Qiqi Qu ◽  
...  
Nanoscale ◽  
2019 ◽  
Vol 11 (23) ◽  
pp. 11360-11368 ◽  
Author(s):  
Hao Yuan ◽  
Yang Wang ◽  
Ting Li ◽  
Yijie Wang ◽  
Piming Ma ◽  
...  

Efficient heat removal via thermal management materials has become one of the most critical challenges in the development of modern microelectronic devices.


2021 ◽  
Vol 4 (2) ◽  
pp. 2136-2142
Author(s):  
Xiao Hou ◽  
Zhenbang Zhang ◽  
Xianzhe Wei ◽  
Yue Qin ◽  
Guichen Song ◽  
...  

Author(s):  
Fuhua Jia ◽  
Emmanuel Oluwaseyi Fagbohun ◽  
Qianyu Wang ◽  
Duoyin Zhu ◽  
Jianling Zhang ◽  
...  

Nanoscale ◽  
2021 ◽  
Author(s):  
Shaoyang Xiong ◽  
Yue Qin ◽  
Linhong Li ◽  
Guoyong Yang ◽  
Maohua Li ◽  
...  

In order to meet the requirement of thermal performance with the rapid development of high-performance electronic devices, constructing a three-dimensional thermal transport skeleton is an effective method for enhancing thermal...


RSC Advances ◽  
2016 ◽  
Vol 6 (27) ◽  
pp. 22364-22369 ◽  
Author(s):  
Zhiduo Liu ◽  
Dianyu Shen ◽  
Jinhong Yu ◽  
Wen Dai ◽  
Chaoyang Li ◽  
...  

Three dimensional graphene foam incorporated into epoxy matrix greatly enhance its thermal conductivity (up to 1.52 W mK−1) at low graphene foam loading (5.0 wt%), over an eight-fold enhancement in comparison with that of neat epoxy.


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