Aluminum surface nitriding by an atmospheric-pressure non-thermal plasma technique

The application of aluminum is often limited by low hardness, and plasma nitriding can make it have excellent mechanical property. The purpose of this study is to nitride the aluminum surface by non-thermal transferred arc plasma technology. During the plasma nitriding process, the maximum effective value of output current is about 390 mA and the overall temperature of the samples is much lower than the solidus temperature. It is found that the microstructure and mechanical properties of the aluminum surface are improved by adding hydrogen into the nitrogen plasma. Compared with the surface treated by pure N2 plasma, the particle size of aluminum surface treated by N2/H2 plasma is smaller. The surface hardness of aluminum is nearly doubled after being treated in 6.0 vol%H2 + 94.0 vol%N2 atmosphere.

Engineering flexible carbon nanofibers concatenated MOFs-derived hollow octahedral CoFe2O4 as anode materials for enhanced lithium storage

Constructing suitable electrode materials with high capacity and excellent mechanical property is indispensable for flexible lithium-ion batteries (LIBs) to satisfy the growing flexible and wearable electronic devices. Herein, a necklace-like...

Porous fluorinated polyarylene ether nitrile as ultralow permittivity dielectrics used under humid environment

Porous FPEN films demonstrating ultralow permittivity, excellent mechanical property and durability under humid environment are efficiently fabricated through the delayed phase inversion approach.

Eugenol micro-emulsion reinforced with silver nanocomposite electrospun mats for wound dressing strategies

Wound management is a complex process that involves application of tissue scaffolds/nanocomposites for wound healing treatment. An ideal wound dressing possesses excellent mechanical property, good biocompatibility and effective antibacterial activity....

The Enhanced Mechanism of 0.05 wt. % Nd Addition on High Temperature Reliability of Sn-3.8Ag-0.7Cu/Cu Solder Joint

In this study, the effect of appropriate Nd addition on improving the high-temperature reliability of Sn-3.8Ag-0.7Cu (SAC387)/Cu solder joint after aging treatment was investigated. The interfacial microstructure of solder joint was refined with proper addition of Nd. This phenomenon could be explained as the adsorbing-hindering effect of surface-active Nd atoms which blocked the growth of brittle intermetallic compounds (IMCs) in the solder joint. Theoretical analysis indicated that 0.05 wt. % addition of Nd could distinctly decrease the growth constant of Cu6Sn5 IMCs and slightly decrease the growth constant of Cu3Sn IMCs respectively. The shear force of SAC387-0.05Nd/Cu solder joint was evidently improved compared with the origin solder joint. In addition, SAC387-0.05Nd/Cu solder joint maintained excellent mechanical property compared with SAC387/Cu solder joint even after 1440 h aging treatment.