Combining Alumina Particles with Three-Dimensional Alumina Foam for High Thermally Conductive Epoxy Composites

2020 ◽  
Author(s):  
Hao Wang ◽  
Linhong Li ◽  
Xianzhe Wei ◽  
Xiao Hou ◽  
Maohua Li ◽  
...  
Keyword(s):  
Three Dimensional ◽  
Epoxy Composites ◽  
Alumina Particles ◽  
Thermally Conductive ◽  
Alumina Foam

High thermally conductive epoxy composite inks cured by infrared laser irradiation for two-dimensional/three-dimensional printing technology

2020 ◽  
Vol 54 (29) ◽  
pp. 4635-4643
Author(s):  
Gi-Tae Park ◽  
Sung Jun Lee ◽  
Byeong Guk Kim ◽  
Sang Hun Lee ◽  
Jae Wook Kang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Three Dimensional ◽  
Diglycidyl Ether ◽  
Epoxy Composites ◽  
Printing Technology ◽  
Three Dimensional Printing ◽  
Bisphenol A Diglycidyl Ether ◽  
Electrical Conductivities ◽  
Thermally Conductive ◽  
Absorbing Material

We propose a new fabrication method of high thermally conductive epoxy composites for 3 D printing technology, which is based on a thermosetting epoxy system containing graphene nanoplate (GNP) as an IR-absorbing material. Firstly, we developed highly heat-dissipating inks based on bisphenol A diglycidyl ether (DGEBA) type epoxy resins containing graphene nanoplate (GNP) which was used as a heat dissipating filler and, simultaneously, an IR-absorbing material for heat induced rapid curing of printed layer. h-BN was also added as a heat dissipating filler in order to increase the thermal conductivity and to decrease the electrical conductivity of the composite. Secondly, by using a micro dispenser equipped with an IR laser, 2D/3D line patterns of thermally conductive epoxy composites were printed and cured in-situ. Thermal and electrical conductivities of the resulting composites were discussed with respect to the resin compositions and the irradiation conditions. The highest thermal conductivity of 2.77 W/m·K was achieved when the contents of GNP and h-BN were 15.0 and 20.0 phr, respectively.

scholarly journals Advances in Liquid Crystalline Epoxy Resins for High Thermal Conductivity

Polymers ◽  
2021 ◽  
Vol 13 (8) ◽  
pp. 1302
Author(s):  
Younggi Hong ◽  
Munju Goh
Keyword(s):  
Thermal Conductivity ◽  
Network Structure ◽  
Epoxy Resins ◽  
Liquid Crystalline ◽  
Random Network ◽  
Three Dimensional ◽  
Heat Insulator ◽  
Liquid Crystalline Epoxy ◽  
Thermally Conductive ◽  
Substantial Interest

Epoxy resin (EP) is one of the most famous thermoset materials. In general, because EP has a three-dimensional random network, it possesses thermal properties similar to those of a typical heat insulator. Recently, there has been substantial interest in controlling the network structure of EP to create new functionalities. Indeed, the modified EP, represented as liquid crystalline epoxy (LCE), is considered promising for producing novel functionalities, which cannot be obtained from conventional EPs, by replacing the random network structure with an oriented one. In this paper, we review the current progress in the field of LCEs and their application to highly thermally conductive composite materials.

Enhanced thermal properties for epoxy composites with a three-dimensional graphene oxide filler

2015 ◽  
Vol 16 (12) ◽  
pp. 2617-2626 ◽  
Author(s):  
Jian Gao ◽  
Jinhong Yu ◽  
Xinfeng Wu ◽  
Baolin Rao ◽  
Laifu Song ◽  
...  
Keyword(s):  
Graphene Oxide ◽  
Thermal Properties ◽  
Three Dimensional ◽  
Epoxy Composites

Tuning the Oxidation Degree of Graphite toward Highly Thermally Conductive Graphite/Epoxy Composites

2018 ◽  
Vol 30 (21) ◽  
pp. 7473-7483 ◽  
Author(s):  
Wen Sun ◽  
Lida Wang ◽  
Zhengqing Yang ◽  
Tianzhen Zhu ◽  
Tingting Wu ◽  
...  
Keyword(s):  
Epoxy Composites ◽  
Oxidation Degree ◽  
Thermally Conductive

Electromagnetic properties of three-dimensional woven carbon fiber fabric/epoxy composite

2017 ◽  
Vol 88 (20) ◽  
pp. 2353-2361 ◽  
Author(s):  
Wei Fan ◽  
Dan-dan Li ◽  
Jia-lu Li ◽  
Juan-zi Li ◽  
Lin-jia Yuan ◽  
...  
Keyword(s):  
Electromagnetic Wave ◽  
Carbon Fiber ◽  
Electromagnetic Interference ◽  
Three Dimensional ◽  
Woven Fabric ◽  
Epoxy Composites ◽  
Woven Composites ◽  
Carbon Fiber Fabric ◽  
Fiber Fabric ◽  
Wave Properties

To investigate the reinforcement architectures effect on the electromagnetic wave properties of carbon fiber reinforced polymer composites, three-dimensional (3D) interlock woven fabric/epoxy composites, 3D interlock woven fabric with stuffer warp/epoxy composites, and 3D orthogonal woven fabric/epoxy composites were studied by the free-space measurement system. The results showed that the three types of 3D woven carbon fiber fabric/epoxy composites had a slight difference in electromagnetic wave properties and the absorption was their dominant radar absorption mechanism. The electromagnetic wave absorption properties of the three types of composites were more than 90% (below −10 dB) over the 11.2–18 GHz bandwidth, and more than 60% (below −4 dB) over the 8–12 GHz bandwidth. Compared with unidirectional carbon fiber reinforced plastics, the three kinds of 3D woven carbon fiber fabric/epoxy composites exhibited better electromagnetic wave absorption properties over a broadband frequency range of 8–18 GHz. Therefore, the three kinds of 3D woven composite are expected to be used as radar absorption structures due to their excellent mechanical properties and outstanding absorption capacity. The total electromagnetic interference shielding effectiveness of the three types of 3D carbon fiber woven composites are all larger than 46 dB over the 8–12 GHz bandwidth, which is evidence that the three types of 3D carbon fiber woven composites can be used as excellent shielding materials for electromagnetic interference.

scholarly journals Three-Dimensional Heterostructured Reduced Graphene Oxide-Hexagonal Boron Nitride-Stacking Material for Silicone Thermal Grease with Enhanced Thermally Conductive Properties

Nanomaterials ◽  
2019 ◽  
Vol 9 (7) ◽  
pp. 938 ◽  
Author(s):  
Weijie Liang ◽  
Xin Ge ◽  
Jianfang Ge ◽  
Tiehu Li ◽  
Tingkai Zhao ◽  
...  
Keyword(s):  
Graphene Oxide ◽  
Boron Nitride ◽  
Reduced Graphene Oxide ◽  
Hexagonal Boron Nitride ◽  
Three Dimensional ◽  
Thermal Interface Materials ◽  
Reduced Graphene ◽  
Thermally Conductive ◽  
Thermal Grease ◽  
Conductive Properties

The thermally conductive properties of silicone thermal grease enhanced by hexagonal boron nitride (hBN) nanosheets as a filler are relevant to the field of lightweight polymer-based thermal interface materials. However, the enhancements are restricted by the amount of hBN nanosheets added, owing to a dramatic increase in the viscosity of silicone thermal grease. To this end, a rational structural design of the filler is needed to ensure the viable development of the composite material. Using reduced graphene oxide (RGO) as substrate, three-dimensional (3D) heterostructured reduced graphene oxide-hexagonal boron nitride (RGO-hBN)-stacking material was constructed by self-assembly of hBN nanosheets on the surface of RGO with the assistance of binder for silicone thermal grease. Compared with hBN nanosheets, 3D RGO-hBN more effectively improves the thermally conductive properties of silicone thermal grease, which is attributed to the introduction of graphene and its phonon-matching structural characteristics. RGO-hBN/silicone thermal grease with lower viscosity exhibits higher thermal conductivity, lower thermal resistance and better thermal management capability than those of hBN/silicone thermal grease at the same filler content. It is feasible to develop polymer-based thermal interface materials with good thermal transport performance for heat removal of modern electronics utilising graphene-supported hBN as the filler at low loading levels.

scholarly journals Development of Thermally Conductive Polyurethane Composite by Low Filler Loading of Spherical BN/PMMA Composite Powder

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Kai-Han Su ◽  
Cherng-Yuh Su ◽  
Cheng-Ta Cho ◽  
Chung-Hsuan Lin ◽  
Guan-Fu Jhou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
Filler Loading ◽  
High Thermal Conductivity ◽  
Heat Diffusion ◽  
Composite Powders ◽  
Polyurethane Composite ◽  
Uniform Dispersion ◽  
Thermally Conductive

Abstract The issue of electronic heat dissipation has received much attention in recent times and has become one of the key factors in electronic components such as circuit boards. Therefore, designing of materials with good thermal conductivity is vital. In this work, a thermally conductive SBP/PU composite was prepared wherein the spherical h-BN@PMMA (SBP) composite powders were dispersed in the polyurethane (PU) matrix. The thermal conductivity of SBP was found to be significantly higher than that of the pure h-BN/PU composite at the same h-BN filler loading. The SBP/PU composite can reach a high thermal conductivity of 7.3 Wm−1 K−1 which is twice as high as that of pure h-BN/PU composite without surface treatment in the same condition. This enhancement in the property can be attributed to the uniform dispersion of SBP in the PU polymer matrix that leads to a three-dimensional continuous heat conduction thereby improving the heat diffusion of the entire composite. Hence, we provide a valuable method for preparing a 3-dimensional heat flow path in polyurethane composite, leading to a high thermal conductivity with a small amount of filler.

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