Contrast Enhanced Microscopy Digital Image Correlation: A General Method to Contact-Free Coefficient of Thermal Expansion Measurement of Polymer Films

2014 ◽  
Vol 6 (7) ◽  
pp. 4856-4863 ◽  
Author(s):  
Jairo A. Diaz ◽  
Robert J. Moon ◽  
Jeffrey P. Youngblood
Keyword(s):  
Thermal Expansion ◽  
Digital Image Correlation ◽  
Polymer Films ◽  
Digital Image ◽  
Coefficient Of Thermal Expansion ◽  
Image Correlation ◽  
Thermal Expansion Measurement ◽  
Contrast Enhanced ◽  
Contact Free ◽  
General Method

scholarly journals Contact-free thermal expansion measurement of very soft elastomers using digital image correlation

2016 ◽  
Vol 51 ◽  
pp. 181-189 ◽  
Author(s):  
Tae-Ik Lee ◽  
Min Sung Kim ◽  
Taek-Soo Kim
Keyword(s):  
Thermal Expansion ◽  
Digital Image Correlation ◽  
Digital Image ◽  
Image Correlation ◽  
Thermal Expansion Measurement ◽  
Contact Free

Thickness‐direction coefficient of thermal expansion measurement of thin polymer films

1991 ◽  
Vol 62 (2) ◽  
pp. 422-430 ◽  
Author(s):  
H. M. Tong ◽  
H. K. D. Hsuen ◽  
K. L. Saenger ◽  
G. W. Su
Keyword(s):  
Thermal Expansion ◽  
Polymer Films ◽  
Coefficient Of Thermal Expansion ◽  
Thickness Direction ◽  
Thin Polymer Films ◽  
Thermal Expansion Measurement ◽  
Thin Polymer

Thermoforming of Polymer Laminate Films: Thermo-Viscoelastic Characterization

2015 ◽  
Author(s):  
E. Truszkiewicz ◽  
D. Tscharnuter ◽  
G. Pilz ◽  
G. Pinter
Keyword(s):  
Thermal Expansion ◽  
Digital Image Correlation ◽  
Digital Image ◽  
Viscoelastic Behavior ◽  
Image Correlation ◽  
Material Modeling ◽  
Mechanical Measurements ◽  
Laminate Film

The thermo-viscoelastic behavior of a polymer laminate film was characterized by mechanical measurements to obtain data for material modeling. The strain was measured using digital image correlation. The film is anisotropic and sustains uniaxial strains up to 60%. Additionally, the thermal expansion was measured for both materials that form the laminate.

Study on the Effect of WC Size on the Thermal Expansion Coefficient of WC/Cu Composites

2013 ◽  
Vol 275-277 ◽  
pp. 1597-1600 ◽  
Author(s):  
Hai Yu ◽  
Rong Xin Guo ◽  
Hai Ting Xia ◽  
Feng Yan ◽  
Yu Bo Zhang
Keyword(s):  
Particle Size ◽  
Thermal Expansion ◽  
Powder Metallurgy ◽  
Digital Image Correlation ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Digital Image ◽  
Correlation Method ◽  
Image Correlation ◽  
Powder Metallurgy Method

Abstract: In order to study the effect of WC size on the thermal expansion coefficient of WC/Cu composites after anneal, WC/Cu composites with different WC particle size were prepared by powder metallurgy method. In this paper the thermal expansion coefficient of WC/Cu composites were measured by digital image correlation method. The results show that the thermal expansion coefficient increased with the increasing of temperature and the particle size.

scholarly journals Thermal expansion coefficient determination of polylactic acid using digital image correlation

2018 ◽  
Vol 32 ◽  
pp. 01007 ◽  
Author(s):  
Adrian - Ioan Botean
Keyword(s):  
Thermal Expansion ◽  
Digital Image Correlation ◽  
Thermal Expansion Coefficient ◽  
Polylactic Acid ◽  
Expansion Coefficient ◽  
Digital Image ◽  
Linear Thermal Expansion Coefficient ◽  
Linear Thermal Expansion ◽  
Correlation Method ◽  
Image Correlation

This paper aims determining the linear thermal expansion coefficient (CTE) of polylactic acid (PLA) using an optical method for measuring deformations called digital image correlation method (DIC). Because PLA is often used in making many pieces with 3D printing technology, it is opportune to know this coefficient to obtain a higher degree of precision in the construction of parts and to monitor deformations when these parts are subjected to a thermal gradient. Are used two PLA discs with 20 and 40% degree of filling. In parallel with this approach was determined the linear thermal expansion coefficient (CTE) for the copper cylinder on the surface of which are placed the two discs of PLA.

High-temperature strain field measurement using digital image correlation

2009 ◽  
Vol 44 (4) ◽  
pp. 263-271 ◽  
Author(s):  
B M B Grant ◽  
H J Stone ◽  
P J Withers ◽  
M Preuss
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Coefficient Of Thermal Expansion ◽  
Black Body ◽  
Black Body Radiation ◽  
Image Correlation ◽  
Nickel Base Superalloy ◽  
Reliable Determination ◽  
Nickel Base ◽  
Two Parameters

A method is presented for obtaining good images of sample surfaces at high temperatures, suitable for strain measurement, by digital image correlation (DIC) without the use of surface markers or speckles. This is accomplished by suppressing black-body radiation through the use of filters and blue illumination. Using only relatively low levels of illumination the method is demonstrated to be capable of providing accurate DIC measurements up to 1100 °C, and the potential to monitor strains to 1400 °C is identified. The capability of the method is demonstrated by measuring the Young's modulus and coefficient of thermal expansion of a nickel-base superalloy at temperatures from ambient to 1000 °C; two parameters that are well established in the literature and that require high strain sensitivity for their reliable determination.

Determination of thermal expansion coefficient of a monofilament polyamide fiber using digital image correlation

2020 ◽  
Vol 87 ◽  
pp. 106540
Author(s):  
S.S. Mendes ◽  
J.C.A.D. Filho ◽  
A.R.A. Melo ◽  
L.C.S. Nunes
Keyword(s):  
Thermal Expansion ◽  
Digital Image Correlation ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Digital Image ◽  
Image Correlation ◽  
Polyamide Fiber
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