Thickness‐direction coefficient of thermal expansion measurement of thin polymer films

1991 ◽  
Vol 62 (2) ◽  
pp. 422-430 ◽  
Author(s):  
H. M. Tong ◽  
H. K. D. Hsuen ◽  
K. L. Saenger ◽  
G. W. Su
Keyword(s):  
Thermal Expansion ◽  
Polymer Films ◽  
Coefficient Of Thermal Expansion ◽  
Thickness Direction ◽  
Thin Polymer Films ◽  
Thermal Expansion Measurement ◽  
Thin Polymer

Mechanical Property Determination for Supported Polymer Films using Double Bending Beams

1986 ◽  
Vol 76 ◽  
Author(s):  
B. J. Han ◽  
H. M. Tong ◽  
K. Saenger ◽  
Carl C. Gryte
Keyword(s):  
Mechanical Properties ◽  
Thermal Expansion ◽  
Polymer Films ◽  
Coefficient Of Thermal Expansion ◽  
Elastic Stiffness ◽  
Thin Polymer Films ◽  
Thin Polymer ◽  
Wet Processing ◽  
Beam Technique ◽  
Different Young’S Modulus

ABSTRACTA double-bending-beam technique has been developed to determine the mechanical properties (e.g., the elastic stiffness parameter and the in-plane coefficient of thermal expansion) of thin polymer films during thermal cycling. The mechanical properties of poly(methyl methacrylate) and a polyimide have been determined from the combined stress-temperature relationships of identical polymer films coated on two rigid beams (each with a distinctly different Young's modulus and coefficient of thermal expansion). The measured mechanical properties were found to agree with data obtained using conventional techniques. The double-bending-beam technique can be applied to a wide variety of dry and wet processing situations involving thin polymer films.

Novel Technique for Measuring Through-Plane Thermo-Mechanical Properties of Thin Polymer Films

1998 ◽  
Vol 511 ◽  
Author(s):  
K. S. Patel ◽  
Sue Ann bidstrup-Allen ◽  
P. A. Kohl ◽  
T. C. HODGE
Keyword(s):  
Polymer Films ◽  
Mechanical Design ◽  
Coefficient Of Thermal Expansion ◽  
Compression Modulus ◽  
Polymer Chains ◽  
Thin Polymer Films ◽  
Electrode Structure ◽  
Thin Polymer ◽  
Characterization Of Properties ◽  
A New Technique

ABSTRACTPolymer thin films (less than 20 ltm) are widely used as coatings and inter-level dielectrics in microelectronic applications. In multi-layer structures, stresses generated in the films due to interaction with adjacent layers and solvent evaporation induced shrinkage, cause the polymer chains to orient in the plane of the film resulting in anisotropic film properties. Characterization of properties in all directions is essential for accurate electrical and mechanical design and modeling.A new technique has been developed to measure, in-situ, the through-plane (z) properties of thin polymer films. A parallel plate capacitor device and an interdigitated electrode structure were used as sensors to detect changes in dielectric constant and thickness of thin polymer films under thermal or mechanical loading. The through-plane compression modulus and coefficient of thermal expansion were calculated and results are reported for benzocyclobutene (BCB) films.

scholarly journals Thermal Expansion of Supported Thin Polymer Films:  A Direct Comparison of Free Surface vs Total Confinement

2001 ◽  
Vol 34 (9) ◽  
pp. 3041-3045 ◽  
Author(s):  
Darrin J. Pochan ◽  
Eric K. Lin ◽  
Sushil K. Satija ◽  
Wen-li Wu
Keyword(s):  
Thermal Expansion ◽  
Free Surface ◽  
Polymer Films ◽  
Thin Polymer Films ◽  
Thin Polymer

Is the chain dynamics in thin polymer films isotropic ?

2000 ◽  
Vol 10 (PR7) ◽  
pp. Pr7-233-Pr7-237 ◽  
Author(s):  
S. Rivillon ◽  
P. Auroy ◽  
B. Deloche
Keyword(s):  
Polymer Films ◽  
Thin Polymer Films ◽  
Chain Dynamics ◽  
Thin Polymer

Reducing the сontact angle hysteresis of thin polymer films by oil impregnation in supercritical carbon dioxide

2021 ◽  
Vol 154 ◽  
pp. 106202
Author(s):  
Polina S. Kazaryan ◽  
Maria A. Agalakova ◽  
Elena P. Kharitonova ◽  
Marat O. Gallyamov ◽  
Mikhail S. Kondratenko
Keyword(s):  
Carbon Dioxide ◽  
Supercritical Carbon Dioxide ◽  
Polymer Films ◽  
Thin Polymer Films ◽  
Thin Polymer ◽  
Oil Impregnation ◽  
Supercritical Carbon
Sign in / Sign up

Export Citation Format

Share Document