scholarly journals Contact-free thermal expansion measurement of very soft elastomers using digital image correlation

2016 ◽  
Vol 51 ◽  
pp. 181-189 ◽  
Author(s):  
Tae-Ik Lee ◽  
Min Sung Kim ◽  
Taek-Soo Kim

Author(s):  
E. Truszkiewicz ◽  
D. Tscharnuter ◽  
G. Pilz ◽  
G. Pinter

The thermo-viscoelastic behavior of a polymer laminate film was characterized by mechanical measurements to obtain data for material modeling. The strain was measured using digital image correlation. The film is anisotropic and sustains uniaxial strains up to 60%. Additionally, the thermal expansion was measured for both materials that form the laminate.



2013 ◽  
Vol 275-277 ◽  
pp. 1597-1600 ◽  
Author(s):  
Hai Yu ◽  
Rong Xin Guo ◽  
Hai Ting Xia ◽  
Feng Yan ◽  
Yu Bo Zhang

Abstract: In order to study the effect of WC size on the thermal expansion coefficient of WC/Cu composites after anneal, WC/Cu composites with different WC particle size were prepared by powder metallurgy method. In this paper the thermal expansion coefficient of WC/Cu composites were measured by digital image correlation method. The results show that the thermal expansion coefficient increased with the increasing of temperature and the particle size.



2018 ◽  
Vol 32 ◽  
pp. 01007 ◽  
Author(s):  
Adrian - Ioan Botean

This paper aims determining the linear thermal expansion coefficient (CTE) of polylactic acid (PLA) using an optical method for measuring deformations called digital image correlation method (DIC). Because PLA is often used in making many pieces with 3D printing technology, it is opportune to know this coefficient to obtain a higher degree of precision in the construction of parts and to monitor deformations when these parts are subjected to a thermal gradient. Are used two PLA discs with 20 and 40% degree of filling. In parallel with this approach was determined the linear thermal expansion coefficient (CTE) for the copper cylinder on the surface of which are placed the two discs of PLA.







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