First-Principles Study of a Full Cycle of Atomic Layer Deposition of SiO2Thin Films with Di(sec-butylamino)silane and Ozone

2013 ◽  
pp. 130911145338002 ◽  
Author(s):  
Liang Huang ◽  
Bo Han ◽  
Bing Han ◽  
Agnes Derecskei-Kovacs ◽  
Manchao Xiao ◽  
...  

RSC Advances ◽  
2020 ◽  
Vol 10 (28) ◽  
pp. 16584-16592
Author(s):  
Kyungtae Lee ◽  
Youngseon Shim

Energy diagram of reaction pathways for decomposition of different aminosilane precursors on a WO3 (001) surface.



RSC Advances ◽  
2017 ◽  
Vol 7 (88) ◽  
pp. 55750-55755 ◽  
Author(s):  
Hwanyeol Park ◽  
Sungwoo Lee ◽  
Ho Jun Kim ◽  
Euijoon Yoon ◽  
Gun-Do Lee

In the fabrication process of memory devices, a void-free tungsten (W) gate process with good conformability is very important for improving the conductivity of the W gate, leading to enhancement of device performance.



RSC Advances ◽  
2018 ◽  
Vol 8 (68) ◽  
pp. 39039-39046 ◽  
Author(s):  
Hwanyeol Park ◽  
Sungwoo Lee ◽  
Ho Jun Kim ◽  
Daekwang Woo ◽  
Jong Myeong Lee ◽  
...  

We investigated the overall ALD reaction mechanism for W deposition on TiN surfaces based on DFT calculation as well as the detailed dissociative reactions of WF6.



2017 ◽  
Vol 4 (10) ◽  
pp. 106403 ◽  
Author(s):  
Hengjiao Gao ◽  
Yuqing Xiong ◽  
Dongcai Zhao ◽  
Lanxi Wang ◽  
Jinxiao Wang


2015 ◽  
Vol 17 (26) ◽  
pp. 17322-17334 ◽  
Author(s):  
Timo Weckman ◽  
Kari Laasonen

A comprehensive density functional study on the reaction mechanisms during the atomic layer deposition of alumina via trimethylaluminium–waterprocess.



2011 ◽  
Vol 115 (18) ◽  
pp. 9250-9259 ◽  
Author(s):  
Ville Mäkinen ◽  
Karoliina Honkala ◽  
Hannu Häkkinen


2014 ◽  
Vol 26 (23) ◽  
pp. 6752-6761 ◽  
Author(s):  
Junling Lu ◽  
Bin Liu ◽  
Nathan P. Guisinger ◽  
Peter C. Stair ◽  
Jeffrey P. Greeley ◽  
...  




2018 ◽  
Author(s):  
Glen N. Fomengia ◽  
Michael Nolan ◽  
Simon D. Elliott

Plasma-enhanced atomic layer deposition (ALD) of metal oxides is a rapidly gaining interest especially in the electronics industry because of its numerous advantages over the thermal process. However, the underlying reaction mechanism is not sufficiently understood, particularly regarding saturation of the reaction and densification of the film. In this work, we employ first principles density functional theory (DFT) to determine the predominant reaction pathways, surface intermediates and by-products formed when constituents of O<sub>2</sub>-plasma or O<sub>3</sub> adsorb onto a methylated surface typical of TMA-based alumina ALD. The main outcomes are that a wide variety of barrierless and highly exothermic reactions can take place. This leads to the spontaneous production of various by-products with low desorption energies and also of surface intermediates from the incomplete combustion of –CH<sub>3</sub> ligands. Surface hydroxyl groups are the most frequently observed intermediate and are formed as a consequence of the conservation of atoms and charge when methyl ligands are initially oxidized (rather than from subsequent re-adsorption of molecular water). Anionic intermediates such as formates are also commonly observed at the surface in the simulations. Formaldehyde, CH<sub>2</sub>O, is the most frequently observed gaseous by-product. Desorption of this by-product leads to saturation of the redox reaction at the level of two singlet oxygen atoms per CH<sub>3</sub> group, where the oxidation state of C is zero, rather than further reaction with oxygen to higher oxidation states. We conclude that the self-limiting chemistry that defines ALD comes about in this case through the desorption by-products with partially-oxidised carbon. The simulations also show that densification occurs when ligands are removed or oxidised to intermediates, indicating that there may be an inverse relationship between Al/O coordination numbers in the final film and the concentration of chemically-bound ligands or intermediate fragments covering the surface during each ALD pulse. Therefore reactions that generate a bare surface Al will produce denser films in metal oxide ALD.



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