scholarly journals Overall reaction mechanism for a full atomic layer deposition cycle of W films on TiN surfaces: first-principles study

RSC Advances ◽  
2018 ◽  
Vol 8 (68) ◽  
pp. 39039-39046 ◽  
Author(s):  
Hwanyeol Park ◽  
Sungwoo Lee ◽  
Ho Jun Kim ◽  
Daekwang Woo ◽  
Jong Myeong Lee ◽  
...  

We investigated the overall ALD reaction mechanism for W deposition on TiN surfaces based on DFT calculation as well as the detailed dissociative reactions of WF6.


RSC Advances ◽  
2020 ◽  
Vol 10 (28) ◽  
pp. 16584-16592
Author(s):  
Kyungtae Lee ◽  
Youngseon Shim

Energy diagram of reaction pathways for decomposition of different aminosilane precursors on a WO3 (001) surface.



RSC Advances ◽  
2017 ◽  
Vol 7 (88) ◽  
pp. 55750-55755 ◽  
Author(s):  
Hwanyeol Park ◽  
Sungwoo Lee ◽  
Ho Jun Kim ◽  
Euijoon Yoon ◽  
Gun-Do Lee

In the fabrication process of memory devices, a void-free tungsten (W) gate process with good conformability is very important for improving the conductivity of the W gate, leading to enhancement of device performance.



Author(s):  
Yeonchoo Cho ◽  
Sang Hyeon Kim ◽  
Byung Seok Kim ◽  
Youngjin Kim ◽  
Woojin Jeon

This study investigates the chemical reaction mechanism of the ALD to obtain a designated growth behaviour in theoretical and experimental way, hence, provides significant implications for understanding the ALD mechanism based on the DFT calculation.



2013 ◽  
pp. 130911145338002 ◽  
Author(s):  
Liang Huang ◽  
Bo Han ◽  
Bing Han ◽  
Agnes Derecskei-Kovacs ◽  
Manchao Xiao ◽  
...  




2017 ◽  
Vol 4 (10) ◽  
pp. 106403 ◽  
Author(s):  
Hengjiao Gao ◽  
Yuqing Xiong ◽  
Dongcai Zhao ◽  
Lanxi Wang ◽  
Jinxiao Wang


2015 ◽  
Vol 17 (26) ◽  
pp. 17322-17334 ◽  
Author(s):  
Timo Weckman ◽  
Kari Laasonen

A comprehensive density functional study on the reaction mechanisms during the atomic layer deposition of alumina via trimethylaluminium–waterprocess.



Author(s):  
Yanghong Yu ◽  
Zhongchao Zhou ◽  
Lina Xu ◽  
Yihong Ding ◽  
Guoyong Fang

Atomic layer deposition (ALD) is a nanopreparation technique for materials and is widely used in the fields of microelectronics, energy and catalysis. ALD methods for metal sulfides, such as Al2S3...



2019 ◽  
Vol 31 (21) ◽  
pp. 8995-9002
Author(s):  
Il-Kwon Oh ◽  
Jong Seo Park ◽  
Mohammad Rizwan Khan ◽  
Kangsik Kim ◽  
Zonghoon Lee ◽  
...  


2012 ◽  
Vol 482-484 ◽  
pp. 627-632
Author(s):  
Heng Liu ◽  
Yu Qing Xiong ◽  
Ji Zhou Wang

In this paper, feasibility of aluminium deposition on inner wall of pipes by atomic layer deposition was studied. Firstly, by solving kinetics equation of gas adsorption on the pipe inner wall, the time for the reactant to reach saturated adsorption on the wall was calculated. Secondly, according to the aluminium crystal structure, the thickness of each deposition cycle was obtained. Finally, the minimum aluminium thickness and number of atomic layer deposition cycles that can meet electromagnetic requirement of wave guide was calculated.



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