Microtensile bond strength tests: scanning electron microscopy evaluation of sample integrity before testing

2002 ◽  
Vol 110 (5) ◽  
pp. 385-391 ◽  
Author(s):  
Marco Ferrari ◽  
Cecilia Goracci ◽  
Fernanda Sadek ◽  
Paulo Eduardo Capel Cardoso
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Bond Strength ◽  
Microtensile Bond Strength ◽  
Strength Tests ◽  
Scanning Electron Microscopy Evaluation ◽  
Scanning Electron

Differential Resin-Dentin Bonds Created after Caries Removal with Polymer Burs

2012 ◽  
Vol 18 (3) ◽  
pp. 497-508 ◽  
Author(s):  
Manuel Toledano ◽  
Inmaculada Cabello ◽  
Monica Yamauti ◽  
Raquel Osorio
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Bond Strength ◽  
Measured Data ◽  
Glass Ionomer ◽  
Single Bond ◽  
Microtensile Bond Strength ◽  
Caries Removal ◽  
Thick Smear ◽  
Scanning Electron

AbstractThe objective of this article was to investigate the effect of carbide and polymer burs caries removal methods on the bond strength of different adhesives to dentin. Resin restorations were performed in sound and caries-affected dentin, after using polymer or carbide burs and bonding with four different adhesive (Single bond, SB; Clearfil SE bond, SEB; FL-Bond II, FLB; and Fuji II-LC, FUJI). Microtensile bond strength (MTBS) was measured. Data were analyzed with ANOVA and Student-Newman-Keuls tests. Debonded surfaces were observed by scanning electron microscopy. Bonded interfaces were examined using light microscopy (Masson's trichrome staining). In sound dentin, MTBS was similar for SEB and SB, and higher than that of FLB and FUJI. Bond strength to carbide bur prepared dentin was similar for SB, SEB, and FLB; FUJI presented the lowest. SB applied on polymer bur excavated dentin presented similar values to those of the carbide bur group; MTBS attained by SEB, FLB, and FUJI decreased when bonding to dentin treated with polymer burs; FUJI yielded pretesting failures in all specimens. Polymer burs created a thick smear layer that was not infiltrated by tested self-etching agents. The bonding effectiveness of self-etching and glass-ionomer-like adhesives to dentin decreased when polymer burs were used.

scholarly journals Reparability of Aged Silorane With Methacrylate-Based Resin Composite: Micro-Shear Bond Strength and Scanning Electron Microscopy Evaluation

2012 ◽  
Vol 37 (1) ◽  
pp. 28-36 ◽  
Author(s):  
L Giachetti ◽  
D Scaminaci Russo ◽  
M Baldini ◽  
C Goracci ◽  
M Ferrari
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Bond Strength ◽  
Intermediate Layer ◽  
Clinical Relevance ◽  
Shear Bond Strength ◽  
Resin Composite ◽  
Composite Restorations ◽  
Scanning Electron Microscopy Evaluation ◽  
Scanning Electron

Clinical Relevance Aged silorane composite restorations can be repaired with a methacrylate-based resin composite by using a phosphate-methacrylate–based adhesive as the intermediate layer.

Bonding performance of different adhesive systems to deproteinized dentin: Microtensile bond strength and scanning electron microscopy

2005 ◽  
Vol 75B (1) ◽  
pp. 158-167 ◽  
Author(s):  
Fábio Barbosa de Souza ◽  
Cláudio Heliomar Vicente Silva ◽  
Regina Guenka Palma Dibb ◽  
Carina Sincler Delfino ◽  
Lúcia Carneiro de Souza Beatrice
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Bond Strength ◽  
Adhesive Systems ◽  
Microtensile Bond Strength ◽  
Bonding Performance ◽  
Scanning Electron

scholarly journals Microtensile Bond Strength and Failure Type Analysis of Self-Etch Adhesive Systems on Superficial and Deep Dentin After Long-term Water Storage

2020 ◽  
Vol 23 (4) ◽  
pp. 12p
Author(s):  
Pinar Cevik ◽  
Arzu Zeynep Yildirim ◽  
Zafer Artvin ◽  
Mutlu Özcan
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Bond Strength ◽  
Resin Composite ◽  
Adhesive System ◽  
Optical Microscope ◽  
Adhesive Systems ◽  
Microtensile Bond Strength ◽  
Dentin Thickness ◽  
Scanning Electron

Objective: The aim of this study was to evaluate and compare the microtensile bond strengths of four current adhesive materials that contain different monomers at deep and superficial dentin. Material and Methods: Forty non-carious human third molars (n = 5) were used in the study. Specimens were divided into two main groups according to dentin thickness as superficial and deep dentin. Groups were further divided into four subgroups in terms of the adhesive systems used: Nova Compo B Plus (NCBP), Nova Compo B (NCB), Futurabond M (FB) and Clearfil S3 Bond Plus (CS3). All specimens were bonded to resin composite and stored in 37 °C water for 9-months. Teeth were sectioned into 3 x 3 mm x 1mm thick beams. Microtensile bond strength test was carried out by using a universal testing device (1 mm/min). After fracture, failure types were observed using an optical microscope and the fractured dentin surfaces were observed by a scanning electron microscopy (SEM). One-way ANOVA and Tukey tests were used to compare the adhesive system in each dentin group. An unpaired T-test was used to compare the dentin thickness in each adhesive material. Results: As compared to deep dentin, superficial dentin showed higher µTBS values in groups NCBP, FB and CS, as opposed to group NCB. Only NCB revealed higher bond strength at deep dentin layers when compared to superficial dentin. In the superficial dentin group, NCBP showed the highest bond strength value, while NCB showed the lowest bond strength. In the deep dentin group, while NCB showed the highest bond strength value, NCBP revealed the lowest bond strength value after 9-months storage. While 4-META and 10-MDP monomer combination (NCBP) resulted in the highest bond strength value among the adhesive systems in the superficial dentin group, the monomer combination (NCB) resulted in the highest bond strength in deep dentin group. Conclusions: Microtensile bond strength performance are affected by both the type of monomer in the adhesive combination and the depth of the dentin. KEYWORDS Adhesive system; dentin thickness; hydrophobic monomer; microtensile bond strength; scanning electron microscopy.

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