scholarly journals A Two Dimensional Tunneling Resistance Transmission Line Model for Nanoscale Parallel Electrical Contacts

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Sneha Banerjee ◽  
John Luginsland ◽  
Peng Zhang

Abstract Contact resistance and current crowding are important to nanoscale electrical contacts. In this paper, we present a self-consistent model to characterize partially overlapped parallel contacts with varying specific contact resistivity along the contact length. For parallel tunneling contacts formed between contacting members separated by a thin insulating gap, we examine the local voltage-dependent variation of potential barrier height and tunneling current along the contact length, by solving the lumped circuit transmission line model (TLM) equations coupled with the tunneling current self consistently. The current and voltage distribution along the parallel tunneling contacts and their overall contact resistance are analyzed in detail, for various input voltage, electrical contact dimension, and material properties (i.e. work function, sheet resistance of the contact members, and permittivity of the insulating layer). It is found the existing one-dimensional (1D) tunneling junction models become less reliable when the tunneling layer thickness becomes smaller or the applied voltage becomes larger. In these regimes, the proposed self-consistent model may provide a more accurate evaluation of the parallel tunneling contacts. For the special case of constant ohmic specific contact resistivity along the contact length, our theory has been spot-checked with finite element method (FEM) based numerical simulations. This work provides insights on the design, and potential engineering, of nanoscale electrical contacts with controlled current distribution and contact resistance via engineered spatially varying contact layer properties and geometry.

1990 ◽  
Vol 216 ◽  
Author(s):  
Patrick W. Leech ◽  
Geoffrey K. Reeves ◽  
Martyn H. Kibel

ABSTRACTThe electrical characteristics of In, Sn, Au and Pt contacts on n-type Hg0.4Cd0.6Te formed in the presence and absence of prior In2+ implantation have been examined. Measurements of specific contact resistance made using a Transmission Line Model have shown that the unimtlanted In/Hg0.4Cd0.6 and Sn/Hg0.4Cd0.6 junctions gave values of pc = 3.0x10−3 to 4.0x10−3 ohm.cm2. Auger sputter profiles of the asdeposited In/Hg0.4Cd0.6 and Sn/Hg0.4Cd0.6 interfaces have shown a significant in-diffusion of the metal overlayer. The influence of shallow In2+ implantation prior to metallization was an increase in pc which occurred above a dose of 1013 ions/cm2. In contrast, Pt and Au formed Schottky barrier diodes on n-type Hg0.4Cd0.6 with øb=0.69eV for Pt and øb=0.79eV for Au. With prior In2+ implantation, both Pt and Au contacts exhibited an ohmic behaviour with pc= 2x10−1 ohm.cm2. These results have significance in the fabrication of devices for 1.0 -2.5μm optical communications.


2008 ◽  
Vol 55 (5) ◽  
pp. 1170-1176 ◽  
Author(s):  
Natalie Stavitski ◽  
Mark J. H. van Dal ◽  
Anne Lauwers ◽  
Christa Vrancken ◽  
Alexey Y. Kovalgin ◽  
...  

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