scholarly journals A novel method for the identification of inorganic and organic gunshot residue particles of lead-free ammunitions from the hands of shooters using scanning laser ablation-ICPMS and Raman micro-spectroscopy

The Analyst ◽  
2014 ◽  
Vol 139 (23) ◽  
pp. 6232-6241 ◽  
Author(s):  
Zuriñe Abrego ◽  
Nagore Grijalba ◽  
Nora Unceta ◽  
Maite Maguregui ◽  
Alicia Sanchez ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Gunshot Residue ◽  
Lead Free ◽  
Scanning Laser ◽  
Novel Method ◽  
Organic Gunshot Residue ◽  
Inorganic And Organic

SLA-ICPMS and Raman micro-spectroscopy has been applied to the characterization of GSR using modified tape lifts.

Unambiguous Characterization of Gunshot Residue Particles Using Scanning Laser Ablation and Inductively Coupled Plasma-Mass Spectrometry

2012 ◽  
Vol 84 (5) ◽  
pp. 2402-2409 ◽  
Author(s):  
Zuriñe Abrego ◽  
Ana Ugarte ◽  
Nora Unceta ◽  
Alberto Fernández-Isla ◽  
M. Aranzazu Goicolea ◽  
...  
Keyword(s):  
Mass Spectrometry ◽  
Laser Ablation ◽  
Inductively Coupled Plasma ◽  
Gunshot Residue ◽  
Scanning Laser ◽  
Inductively Coupled ◽  
Plasma Mass Spectrometry

Characterization of lead-free gunshot residue analogs

2016 ◽  
Vol 8 (15) ◽  
pp. 3132-3139 ◽  
Author(s):  
Lashaundra A. Fambro ◽  
Ethan T. Miller ◽  
Deidre D. Vandenbos ◽  
Christopher R. Dockery
Keyword(s):  
Spectrochemical Analysis ◽  
Gunshot Residue ◽  
Lead Free ◽  
Gunshot Residues

Spectrochemical analysis and microscopy were used to identify statistically significant analytical markers present in simulated lead-free gunshot residues.

Characterization of aluminum, brass and steel nanoparticles after laser ablation

2009 ◽  
Author(s):  
Nancy Van Suetendael ◽  
Kristie Powell ◽  
Susan Earles ◽  
Mary Helen McCay ◽  
Ivica Kostanic
Keyword(s):  
Laser Ablation

Characterization of some Lead-Free Bronzes

2013 ◽  
Vol 50 (3) ◽  
pp. 177-195
Author(s):  
D. Živković ◽  
A. Mitovski ◽  
S. Novaković ◽  
Lj. Balanović ◽  
D. Marković ◽  
...  
Keyword(s):  
Lead Free

Detection and Characterization of an Electrical Failure Induced during Laser Ablation of Packages

2008 ◽  
Author(s):  
P. Schwindenhammer ◽  
H. Murray ◽  
P. Descamps ◽  
P. Poirier
Keyword(s):  
Laser Ablation ◽  
Integrated Circuits ◽  
Failure Analysis ◽  
Ablation Process ◽  
Thermally Induced ◽  
Electrical Failure ◽  
Electrical Phenomenon ◽  
Semiconductor Packages ◽  
Complex Semiconductor

Abstract Decapsulation of complex semiconductor packages for failure analysis is enhanced by laser ablation. If lasers are potentially dangerous for Integrated Circuits (IC) surface they also generate a thermal elevation of the package during the ablation process. During measurement of this temperature it was observed another and unexpected electrical phenomenon in the IC induced by laser. It is demonstrated that this new phenomenon is not thermally induced and occurs under certain ablation conditions.

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