scholarly journals Atomic layer deposition of Al2O3 on MoS2, WS2, WSe2, and h-BN: surface coverage and adsorption energy

RSC Advances ◽  
2017 ◽  
Vol 7 (2) ◽  
pp. 884-889 ◽  
Author(s):  
Taejin Park ◽  
Hoijoon Kim ◽  
Mirine Leem ◽  
Wonsik Ahn ◽  
Seongheum Choi ◽  
...  

The adsorption energies of trimethyl-aluminum on 2D crystals are extracted by quantifying the surface coverage of Al2O3 grown by atomic layer deposition.

Nanoscale ◽  
2015 ◽  
Vol 7 (24) ◽  
pp. 10622-10633 ◽  
Author(s):  
Carlos Guerra-Nuñez ◽  
Yucheng Zhang ◽  
Meng Li ◽  
Vipin Chawla ◽  
Rolf Erni ◽  
...  

A new strategy to tailor the surface and interface of ultrathin TiO2 coatings deposited by “temperature-step” atomic layer deposition with complete surface coverage of non-functionalized multiwall carbon nanotubes.


Langmuir ◽  
2014 ◽  
Vol 30 (13) ◽  
pp. 3741-3748 ◽  
Author(s):  
Moataz Bellah M. Mousa ◽  
Christopher J. Oldham ◽  
Gregory N. Parsons

2014 ◽  
Vol 563 ◽  
pp. 44-49
Author(s):  
A. Lamperti ◽  
A. Molle ◽  
E. Cianci ◽  
C. Wiemer ◽  
S. Spiga ◽  
...  

2010 ◽  
Vol 49 (11) ◽  
pp. 111201 ◽  
Author(s):  
Hai-Dang Trinh ◽  
Edward Yi Chang ◽  
Yuen-Yee Wong ◽  
Chih-Chieh Yu ◽  
Chia-Yuan Chang ◽  
...  

2013 ◽  
Vol 750-752 ◽  
pp. 1052-1056 ◽  
Author(s):  
Guang Fen Zhou ◽  
Jie Ren ◽  
Shao Wen Zhang

The initial surface reaction mechanisms of atomic layer deposition TiO2on H/Si (100 )-2×1 surface using Ti (OCH3)4and H2O as precursors are investigated by density functional theory. The ALD process is divided into two half-reactions, i.e., Ti (OCH3)4and H2O half-reactions. The adsorption energy of Ti (OCH3)4on H/Si (100)2×1 surface is only-2.4 kJ/mol. The overall reaction of Ti (OCH3)4is exothermic, which indicates that Ti (OCH3)4half-reactions are favorable on thermodynamic. Howerver, H2O half-reactions are endothermic and thermodynamically unfavorable.


2004 ◽  
Vol 811 ◽  
Author(s):  
Xinye Liu ◽  
Sasangan Ramanathan ◽  
Eddie Lee ◽  
Thomas E. Seidel

AbstractAluminum nitride (AlN) thin films were deposited from trimethyl aluminum (TMA) and Ammonia (NH3) by thermal atomic layer deposition (thermal ALD) and plasma enhanced atomic layer deposition (PEALD) on 200 mm silicon wafers. For both thermal ALD and PEALD, the deposition rate increased significantly with the deposition temperature. The deposition rate did not fully saturate even with 10 seconds of NH3 pulse time. Plasma significantly increased the deposition rate of AlN films. A large number of incubation cycles were needed to deposit AlN films on Si wafers. 100% step coverage was achieved on trenches with aspect ratio of 35:1 at 100 nm feature size by thermal ALD. X-ray diffraction (XRD) data showed that the AlN films deposited from 370 °C to 470 °C were polycrystalline. Glancing angle X-ray reflection (XRR) results showed that the RMS roughness of the films increased as the film thickness increased.


2012 ◽  
Vol 112 (10) ◽  
pp. 104110 ◽  
Author(s):  
Stephen McDonnell ◽  
Adam Pirkle ◽  
Jiyoung Kim ◽  
Luigi Colombo ◽  
Robert M. Wallace

2021 ◽  
Vol 3 (1) ◽  
pp. 59-71
Author(s):  
Degao Wang ◽  
Qing Huang ◽  
Weiqun Shi ◽  
Wei You ◽  
Thomas J. Meyer

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