Thickness-dependent and anisotropic thermal conductivity of black phosphorus nanosheets

Nanoscale ◽  
2018 ◽  
Vol 10 (13) ◽  
pp. 5985-5989 ◽  
Author(s):  
Seong Gi Jeon ◽  
Hosun Shin ◽  
Yun Hwan Jaung ◽  
Jinho Ahn ◽  
Jae Yong Song

Thickness effects on thermal conductivities of black phosphorus nanosheets, which are anisotropic in the zigzag and armchair planar directions, are experimentally and theoretically investigated in the thickness range of 13 to 48 nm.

2021 ◽  
Vol 2069 (1) ◽  
pp. 012030
Author(s):  
A N Karim ◽  
B Adl-Zarrabi ◽  
P Johansson ◽  
A Sasic Kalagasidis

Abstract Aerogel-based plasters are composite materials with declared thermal conductivities in the range of traditional insulating materials, i.e. 30-50 mW/(m·K). Based on the results from reported field measurements, aerogel-based plasters can significantly reduce the thermal transmittance of uninsulated walls. However, the in-situ measured thermal conductivities have sometimes been higher than the declared values measured in laboratory and in the main direction of the heat flow. Meanwhile, the anisotropic thermal performance of aerogel-based plasters, i.e., deviating thermal performance in the different directions of heat flow, has not been explored yet. The objective of this study is thus to evaluate the anisotropic thermal conductivity of an aerogel-based plaster. This is done in a set of laboratory measurements using the transient plane source method. Six identical and cubic samples with the dimensions of 10×10×10 cm3 were paired two and two, creating three identical sample sets. In total, 360 measurements of thermal conductivity and thermal diffusivity, and 130 measurements for specific heat capacity were conducted. The results indicate a weak anisotropy of less than ±6.5 % between the three directions (x, y, z). Considering the accuracy of the selected measurement technique, better than ±5 %, supplementary measurements using another technique are recommended.


2016 ◽  
Vol 29 (3) ◽  
pp. 1603297 ◽  
Author(s):  
Bo Sun ◽  
Xiaokun Gu ◽  
Qingsheng Zeng ◽  
Xi Huang ◽  
Yuexiang Yan ◽  
...  

2019 ◽  
Vol 9 (4) ◽  
pp. 1311-1316 ◽  
Author(s):  
Heguang Liu ◽  
Jianxi Liu ◽  
Ruixuan Jing ◽  
Caiyin You

Abstract


Author(s):  
Yutaka Kumano ◽  
Tetsuyoshi Ogura ◽  
Toru Yamada

As multilayered circuit boards in which semiconductors are embedded have been well reported, thermal management is becoming quite an important issue. In order to predict the junction temperature of an embedded semiconductor precisely, it is necessary that line patterns should be taken into consideration for thermal fluid analysis. However modeling all the patterns correctly is unacceptable because of far too long calculation time. Thus only the ratio of a pattern area to a gross board area was considered, which caused up to 30% calculation error compared to the experimental results. We have developed a novel method to predict semiconductor junction temperatures precisely without modeling patterns themselves. Firstly boards are divided into multiple regions in order to express how much dense or coarse the patterns are. Since the size of each region is much larger than L/S (line and space) specification of the boards, the number of meshes for calculation does not increase explosively and the simulation can be finished within appropriate time. Secondly equivalent anisotropic thermal conductivity of each region is assigned as follows. All the regions are once divided into smaller subregions whose sizes are approximately L/S specification. Then thermal conductivity of each subregion is defined by the property of the material at the centered subregion. After that a thermal network composed of all the subregions is generated and anisotropic thermal conductivities of each divided region are computed by solving this thermal network matrix. This procedure should be executed in an electrical CAD (E-CAD) where line pattern data are stored. A new interface format using which we can transfer board data from E-CAD to thermal fluid simulator was prepared. This format can have not only layouts and sizes but also anisotropic thermal conductivities of all divided regions. There is no need either to prepare model geometries or to input attributes of a great number of divided regions on thermal fluid simulator. By way of this format, analytical models are imported in thermal fluid simulator and semiconductor junction temperatures are computed. It was confirmed that semiconductor junction temperatures calculated by this method were precisely coincident with the experimental results. We can predict semiconductor temperatures without making preproduction samples. This analysis methodology will highly contribute to the reduction of designing time and cost.


2015 ◽  
Vol 27 (48) ◽  
pp. 8017-8022 ◽  
Author(s):  
Hyejin Jang ◽  
Joshua D. Wood ◽  
Christopher R. Ryder ◽  
Mark C. Hersam ◽  
David G. Cahill

Author(s):  
Maryam Mahnama ◽  
Mostafa Meshkinghalam ◽  
Masoumeh Ozmaian

Abstract Single-layer black phosphorus (SLBP) also known as phosphorene is a recently introduced two-dimensional material with unique structure and promising physical properties that has drawn considerable attention in the field of nanodevices. This structure demonstrates a high anisotropy in mechanical and thermal behavior along zigzag (ZZ) and armchair (AC) principal in-plane directions. Here in this study, it is shown that implementing shear strain on 10nm×50nm SLBP nanoribbons (SLBPNRs) along ZZ and AC directions, the anisotropy leads to different corrugated patterns on the pristine structure. Applying non-equilibrium molecular dynamics under a parameterized Stillinger-Weber potential for modelling SLBP, thermal conductivity (TC) behavior of the sheared SLBPNRs with corrugated patterns are examined. The results show a higher amplitude and wavelength of the corregations on the ZZ-alighned SLBPNRs, which is around two times higher than that of AC-alighned counterparts. Although, it is also shown that unlike some other 2D materials, such as graphene, the wrinkling does not have such a significant effect on TC of SLBP. The phonon density of states results obtained in this work as well as phonon dispersion curves by first-principle calculations in other works concrete this finding. The results show small frequency shifts in both high- and low-frequency phonons, which are not strong enough to affect TC in SLBPNRs. This interesting thermal propertiy of SLBP under shear strain suggests the great potential application of these corrugated structures in nanodevices without any loss of TC abilities.


2018 ◽  
Vol 123 (14) ◽  
pp. 145104 ◽  
Author(s):  
Tianyu Wang ◽  
Meng Han ◽  
Ridong Wang ◽  
Pengyu Yuan ◽  
Shen Xu ◽  
...  

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