Multiscale Simulation for Exploring Photo-Chemical Processes to Mitigate the Critical Dimension Variability of Contact Hole in EUV Lithography

Author(s):  
Sungwoo Park ◽  
Hyungwoo Lee ◽  
Muyoung Kim ◽  
Taegyeom Kim ◽  
Byunghoon Lee ◽  
...  

In extreme ultraviolet lithography (EUVL), non-uniformity of patterned surface roughness of contact holes results in pattern failures such as bridging- or missing holes, which affect production yield. In this study,...

2007 ◽  
Vol 46 (9B) ◽  
pp. 6145-6149
Author(s):  
Sungmin Huh ◽  
Hoon Kim ◽  
Ilyong Jang ◽  
Sung-Yong Cho ◽  
Dongwan Kim ◽  
...  

2017 ◽  
Vol 6 (3-4) ◽  
Author(s):  
Andreas Erdmann ◽  
Dongbo Xu ◽  
Peter Evanschitzky ◽  
Vicky Philipsen ◽  
Vu Luong ◽  
...  

AbstractThe reflection and diffraction of extreme ultraviolet (EUV) light from lithographic masks and the projection imaging of these masks by all-reflective systems introduce several significant imaging artifacts. The off-axis illumination of the mask causes asymmetric shadowing, a size bias between features with different orientations and telecentricity errors. The image contrast varies with the feature orientation and can easily drop far below intuitively expected values. The deformation of the wavefront or phase of the incident light by thick absorbers generates aberration-like effects, especially variations of the best-focus (BF) position vs. the pitch and size of the imaged patterns. Partial reflection of light from the top of the absorber generates a weak secondary image, which superposes with the main image. Based on a discussion of the root causes of these phenomena, we employ mask diffraction and imaging analysis for a quantitative analysis of these effects for standard EUV masks. Simulations for various non-standard types of mask stacks (e.g. etched multilayers, buried shifters, etc.) and for various non-standard absorber materials are used to explore the imaging capabilities of alternative masks for EUV lithography. Finally, an outlook at anamorphic systems for larger numerical apertures is given.


2015 ◽  
Vol 4 (4) ◽  
Author(s):  
Takahiro Kozawa

AbstractOwing to the worldwide efforts, the development of extreme ultraviolet (EUV) lithography has significantly progressed during the past decade. The resolution of chemically amplified resists has reached sub-16-nm region. From the viewpoint of the extendibility of EUV lithography, the development of resist materials capable of resolving sub-10-nm is an urgent task. In this review, the resist material options for EUV lithography are discussed on the basis of the EUV sensitization mechanisms after reviewing the problems for the sub-10-nm fabrication.


2010 ◽  
Author(s):  
Eun-Jin Kim ◽  
Jee-Hye You ◽  
Seoung-Sue Kim ◽  
Han-Ku Cho ◽  
Jinho Ahn ◽  
...  

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