Ultra-low-capacitance flip-chip-bonded GaInAs PIN photodetector for long-wavelength high-data-rate fibre-optic systems

1985 ◽  
Vol 21 (14) ◽  
pp. 593 ◽  
Author(s):  
R.S. Sussmann ◽  
R.M. Ash ◽  
A.J. Moseley ◽  
R.C. Goodfellow
1986 ◽  
Author(s):  
A. J. Moseley ◽  
J. Hankey ◽  
B. T. Debney ◽  
K. L. Monham ◽  
L. G. Stone ◽  
...  

2015 ◽  
Vol 2015 (1) ◽  
pp. 000616-000620 ◽  
Author(s):  
S. Bernabé ◽  
G. Pares ◽  
B. Blampey ◽  
K. Rida ◽  
O. Castany ◽  
...  

Achieving high data speed (typically Nx25 Gbps) compact optoelectronic modules is now made possible by using Photonic Integrated Circuits (PIC) combined with CMOS electronic drivers. Among the techniques that can be used to combine both circuits, flip-chip assembly based on micro-bumps shows several advantages, for example low RF parasitics and high density compared to wire bonding. Using this technique, it is possible to build low consumption photonic receivers working at 25 Gbps.


1998 ◽  
Author(s):  
Robert Kerczewski ◽  
Duc Ngo ◽  
Diepchi Tran ◽  
Quang Tran ◽  
Brian Kachmar

Author(s):  
John D. Terry ◽  
Juha Heiskala ◽  
Victor Stolpman ◽  
Majid Fozunbal

Author(s):  
Chayil Timmerman ◽  
Miles Benson ◽  
John Delisle ◽  
Justin Delva ◽  
Robert Elliott ◽  
...  
Keyword(s):  

Sign in / Sign up

Export Citation Format

Share Document