Deposition and properties of polycrystalline -SiC films using LPCVD with different dopant amount

2006 ◽  
Vol 42 (13) ◽  
pp. 775 ◽  
Author(s):  
S. Noh ◽  
X. Fu ◽  
L. Chen ◽  
M. Mehregany
Keyword(s):  
2006 ◽  
Vol 252 (12) ◽  
pp. 4340-4344 ◽  
Author(s):  
Z.D. Sha ◽  
X.M. Wu ◽  
L.J. Zhuge

2016 ◽  
Vol 182 ◽  
pp. 81-84 ◽  
Author(s):  
Bin Li ◽  
Qi Li ◽  
Hirokazu Katsui ◽  
Takashi Goto ◽  
Rong Tu

2007 ◽  
Vol 136 (2) ◽  
pp. 613-617 ◽  
Author(s):  
Sangsoo Noh ◽  
Xiaoan Fu ◽  
Li Chen ◽  
Mehran Mehregany

2004 ◽  
Vol 13 (6) ◽  
pp. 972-976 ◽  
Author(s):  
D. Gao ◽  
C. Carraro ◽  
V. Radmilovic ◽  
R.T. Howe ◽  
R. Maboudian

Ultrasonics ◽  
2004 ◽  
Vol 42 (1-9) ◽  
pp. 391-394
Author(s):  
Mami Matsukawa ◽  
Satoshi Murata ◽  
Takashi Matsumoto ◽  
Takaomi Matsutani ◽  
Masato Kiuchi

2009 ◽  
Vol 610-613 ◽  
pp. 853-858 ◽  
Author(s):  
Xiao Jing Xu ◽  
Deng Fu Xia

The nano-indentation response and the friction/wear properties of DLC/SiC (diamond-like carbon/silicon carbon) double layer thin films deposited on Mg alloy (AZ91D) substrate using magnetron sputtering technique at room temperature were investigated. The results show that the DLC films displayed low nano-hardness (3.05 GPa), low Young's modulus (24.67 GPa) but high hardness-to-modulus ratio (0.124). The films-substrate system exhibited a good friction and wear properties with the mean friction coefficient of about 0.175, the special wear rate in the magnitude order of 10−6 mm3 m−1 N−1 together with little film-cracking and interface-delaminating, when sliding against Si3N4 (silicon nitride) ball using ball-on-disc wear tester under dry frictional condition. The high wear-resistance is in accordance with high ductility of the films, good modulus match in the films-substrate system, and high hardness-to-modulus ratio of the films. The underlying factors are discussed and are believed to be due to the substrate is Mg, a metal with high activity.


2008 ◽  
Vol 600-603 ◽  
pp. 207-210 ◽  
Author(s):  
Marcin Zielinski ◽  
Marc Portail ◽  
Thierry Chassagne ◽  
Yvon Cordier

We discuss the influence of the growth conditions (composition of the gaseous phase, growth duration, growth temperature) and wafer properties (orientation, miscut, thickness) on the residual strain of 3C-SiC films grown on silicon substrates. We show that the strain related effects are observed for both studied orientations however some of them (namely the creep effects) were up to now stated only for (100) oriented layers. We also point out the main difference in strain control between the (111) and (100) orientations.


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