Study on the Fatigue Characteristics and Remaining Fatigue Life Prediction of Field Emulsified Asphalt Cold Recycled Mixture

CICTP 2017 ◽  
2018 ◽  
Author(s):  
Huailei Cheng ◽  
Liping Liu ◽  
Lijun Sun
Author(s):  
Hakan Ozaltun ◽  
Jeremy Seidt ◽  
M.-H. Herman Shen ◽  
Tommy George ◽  
Charles Cross

An energy based fatigue life prediction framework has been developed for calculation of remaining fatigue life of in-service gas turbine materials. The purpose of the life prediction framework is to account for the material aging effect on fatigue strength of gas turbine engines structural components which are usually designed for infinite life. Previous studies [1–7] indicate the total strain energy dissipated during a monotonic fracture process and a cyclic process is a material property that can be determined by measuring the area underneath the monotonic true stress-strain curve and the sum of the area within each hysteresis loop in the cyclic process, respectively. The energy-based fatigue life prediction framework consists of the following entities: (1) development of a testing procedure to achieve plastic energy dissipation per life cycle and (2) incorporation of an energy-based fatigue life calculation scheme to determine the remaining fatigue life of in-service gas turbine materials. The accuracy of the remaining fatigue life prediction method was verified by comparison between model approximation and experimental results of Aluminum 6061-T6 (Al 6061-T6). The comparison shows promising agreement, thus validating the capability of the framework to produce accurate fatigue life prediction.


2013 ◽  
Vol 51 ◽  
pp. 916-923 ◽  
Author(s):  
P. Williams ◽  
M. Liakat ◽  
M.M. Khonsari ◽  
O.M. Kabir

2020 ◽  
Vol 37 (4) ◽  
pp. 165-171
Author(s):  
Dongbo Li ◽  
Jianpei Wang ◽  
Bing Yang ◽  
Yongle Hu ◽  
Ping Yang

Purpose This paper aims to perform experimental test on fatigue characteristics of package on package (POP) stacked chip assembly under thermal cycling load. Some suggestions for design to prolong fatigue life of POP stacked chip assembly are provided. Design/methodology/approach The POP stacked chip assembly which contains different package structure mode and chip position was manufactured. The fatigue characteristics of POP stacked chip assembly under thermal cycling load were tested. The fatigue load spectrum of POP stacked chip assembly under thermal cycling load was given. The fatigue life of chips can be estimated by using the creep–fatigue life prediction model based on different stress conditions. Findings The solder joint stress of top package is significantly less than that of bottom solder joints, and the maximum value occurs in the middle part of the solder joints inner ring. Originality/value This paper fulfils useful information about the thermal reliability of POP stacked chip assembly with different structure characteristics and materials parameters.


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