Thermal performance and fatigue life prediction of POP stacked chip assembly under thermal cycling load

2020 ◽  
Vol 37 (4) ◽  
pp. 165-171
Author(s):  
Dongbo Li ◽  
Jianpei Wang ◽  
Bing Yang ◽  
Yongle Hu ◽  
Ping Yang
Keyword(s):  
Fatigue Life ◽  
Thermal Cycling ◽  
Life Prediction ◽  
Solder Joints ◽  
Fatigue Life Prediction ◽  
Load Spectrum ◽  
Thermal Reliability ◽  
Joint Stress ◽  
Content Type ◽  
Fatigue Characteristics

Purpose This paper aims to perform experimental test on fatigue characteristics of package on package (POP) stacked chip assembly under thermal cycling load. Some suggestions for design to prolong fatigue life of POP stacked chip assembly are provided. Design/methodology/approach The POP stacked chip assembly which contains different package structure mode and chip position was manufactured. The fatigue characteristics of POP stacked chip assembly under thermal cycling load were tested. The fatigue load spectrum of POP stacked chip assembly under thermal cycling load was given. The fatigue life of chips can be estimated by using the creep–fatigue life prediction model based on different stress conditions. Findings The solder joint stress of top package is significantly less than that of bottom solder joints, and the maximum value occurs in the middle part of the solder joints inner ring. Originality/value This paper fulfils useful information about the thermal reliability of POP stacked chip assembly with different structure characteristics and materials parameters.

Fatigue life prediction for automobile stabilizer bar

2019 ◽  
Vol 11 (2) ◽  
pp. 303-323
Author(s):  
Shuangshuang Li ◽  
Xintian Liu ◽  
Xiaolan Wang ◽  
Yansong Wang
Keyword(s):  
Fatigue Life ◽  
Life Prediction ◽  
Test Sample ◽  
Fatigue Life Prediction ◽  
Bench Test ◽  
Load Spectrum ◽  
Content Type ◽  
Life Model ◽  
On The Road ◽  
The Impact

Purpose During the running of automobile, the stabilizer bar is frequently subjected to the impact of complex random loads, which is prone to fatigue failure and accident. In regard to this, the purpose of this paper is to study and discuss fatigue life of automobile stabilizer bar. Design/methodology/approach Durability bench test shows that failure is located at the joint of sleeve and stabilizer bar body. Based on the collection and compilation of micro-strain load spectrum of the stabilizer bar, the strain-life model is studied considering the influence of average stress and maximum stress at failure area. Seven-grade strain-life curves of the stabilizer bar are established. According to the principle of linear damage accumulation, the relationship between fatigue life and damage is discussed, then the fatigue life of stabilizer bar is predicted. Fatigue life evaluation is carried out from three aspects: reliability analysis, static analysis and fatigue life simulation. Findings The results show that the reliability of the test sample is 99.9 percent when the confidence is 90 percent and the durability is 1,073 load spectrum cycles; the ratios of predicted and simulated life to design life are 2.77 and 2.30, respectively. Originality/value Based on the road load characteristics of automobile stabilizer bar, the method of fatigue life prediction and evaluation is discussed, which provides a basis for the design and development of automobile chassis components.

Modern Approaches to Fatigue Life Prediction of SMT Solder Joints

1991 ◽  
pp. 384-405 ◽  
Author(s):  
Thomas J. Kilinski ◽  
Jon R. Lesniak ◽  
Bela I. Sandor
Keyword(s):  
Fatigue Life ◽  
Life Prediction ◽  
Solder Joints ◽  
Fatigue Life Prediction

A Damage Mechanics-Based Fatigue Life Prediction Model for Solder Joints

2003 ◽  
Vol 125 (1) ◽  
pp. 120-125 ◽  
Author(s):  
Hong Tang ◽  
Cemal Basaran
Keyword(s):  
Fatigue Life ◽  
Prediction Model ◽  
Life Prediction ◽  
Damage Mechanics ◽  
Solder Joints ◽  
Experimental Results ◽  
Fatigue Life Prediction ◽  
Isotropic Hardening ◽  
Cyclic Shear ◽  
Life Prediction Model

A thermomechanical fatigue life prediction model based on the theory of damage mechanics is presented. The damage evolution, corresponding to the material degradation under cyclic thermomechanical loading, is quantified thermodynamic framework. The damage, as an internal state variable, is coupled with unified viscoplastic constitutive model to characterize the response of solder alloys. The damage-coupled viscoplastic model with kinematic and isotropic hardening is implemented in ABAQUS finite element package to simulate the cyclic softening behavior of solder joints. Several computational simulations of uniaxial monotonic tensile and cyclic shear tests are conducted to validate the model with experimental results. The behavior of an actual ball grid array (BGA) package under thermal fatigue loading is also simulated and compared with experimental results.

A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint

2019 ◽  
Vol 141 (4) ◽  
Author(s):  
Sinan Su ◽  
Francy John Akkara ◽  
Ravinder Thaper ◽  
Atif Alkhazali ◽  
Mohammad Hamasha ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Life Prediction ◽  
Prediction Models ◽  
Solder Joints ◽  
State Of The Art ◽  
Electronic Devices ◽  
Creep Damage ◽  
Fatigue Life Prediction ◽  
Factors Affecting ◽  
Causes Of Failure

Fatigue failure of solder joints is one of the major causes of failure in electronic devices. Fatigue life prediction models of solder joints were first put forward in the early 1960s, and since then, numbers of methods were used to model the fatigue mechanism of solder joints. In this article, the majority fatigue life models are summarized, with emphasis on the latest developments in the fatigue life prediction methods. All the models reviewed are grouped into four categories based on the factors affecting the fatigue life of solder joints, which are: plastic strain-based fatigue models, creep damage-based fatigue models, energy-based fatigue models, and damage accumulation-based fatigue models. The models that do not fit any of the above categories are grouped into “other models.” Applications and potential limitations for those models are also discussed.

Comparison of fatigue life prediction methods for solder joints under random vibration loading

2019 ◽  
Vol 95 ◽  
pp. 58-64 ◽  
Author(s):  
Jiang Xia ◽  
Lin Yang ◽  
Qunxing Liu ◽  
Qi Peng ◽  
LanXian Cheng ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Life Prediction ◽  
Random Vibration ◽  
Solder Joints ◽  
Fatigue Life Prediction ◽  
Prediction Methods ◽  
Vibration Loading
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