Growth kinetics of intermediate compounds at a planar solid-solid or solid-liquid interface by diffusion mechanisms

1997 ◽  
Vol 82 (12) ◽  
pp. 6001-6007 ◽  
Author(s):  
André Coulet ◽  
Karine Bouche ◽  
Francis Marinelli ◽  
Francoise Barbier
Keyword(s):  
Growth Kinetics ◽  
Liquid Interface ◽  
Diffusion Mechanisms ◽  
Solid Liquid Interface ◽  
Solid Liquid ◽  
Kinetics Of

Growth kinetics of IMC at the solid Cu/liquid Sn interface

2018 ◽  
Vol 30 (3) ◽  
pp. 145-152
Author(s):  
Zuozhu Yin ◽  
Fenglian Sun ◽  
Yang Liu ◽  
Yang Liu
Keyword(s):  
Mathematical Model ◽  
Growth Kinetics ◽  
Growth Index ◽  
Optical Microscope ◽  
Liquid Interface ◽  
Grain Coarsening ◽  
Content Type ◽  
Solid Liquid Interface ◽  
Solid Liquid ◽  
Kinetics Of

Purpose The purpose of this paper is to investigate growth kinetics of interfacial Cu-Sn intermetallic compound (IMC) at the solid Cu/liquid Sn interface. Design/methodology/approach The Sn/Cu solid–liquid interfacial IMCs are fabricated under various soldering temperatures (240°C-270°C) and soldering times (5-240 s) by dipping method. The thickness and morphology of IMC are observed and analyzed by the optical microscope and scanning electron microscope. Findings Holding at 260°C, Cu/Sn solid–liquid interface Cu6Sn5 growth index experience a change from 0.08 to 0.30 within 10-190 s. The growth index is 0.08 in 10-40 s; the growth index is 0.30 in 40-190 s. Cu6Sn5 grain coarsening index is constant within 10-190 s. It is 0.13. The result of the index of Cu6Sn5 grain coarsening is different from predecessors 27 results Cu6Sn5 grain coarsening index for 1/3. This is because Cu6Sn5 grain grows at the expense of its near small grain to reduce the surface Gibbs free energy, and its morphology changes from regular shape to irregular shape. It sets up the mathematical expression about the initial formation time and temperature of Cu3Sn in 240°C-270°C. Originality/value It obtains a mathematical model to express the changes of solid–liquid interface frontier concentration which has an effect on the interfacial Cu6Sn5 layer growth index and the Cu6Sn5 grain coarsening index. Different indexes can be obtained by establishing relevance equations, which can be used to predict the growth of the interface IMC layer. This mathematical model is established to design the solder pads and the sizes of the solder joints.

An Organodiselenide Containing Electrolyte Enables Sulfurized Polyacrylonitrile Cathodes with Fast Redox Kinetics in Li-S batteries

2021 ◽  
Author(s):  
Wei Zhang ◽  
Qiang Wu ◽  
Ziqi Zeng ◽  
Chuang Yu ◽  
Shijie Cheng ◽  
...  
Keyword(s):  
Liquid Interface ◽  
Electrolyte Additive ◽  
Redox Kinetics ◽  
Solid Liquid Interface ◽  
Solid Liquid ◽  
Kinetics Of

A soluble organoselenide compound, phenyl diselenide (PDSe), is employed as a soluble electrolyte additive to enhance the kinetics of sulfurized polyacrylonitrile cathode, in which radical exchange in the solid-liquid interface...

A New Growth Kinetics in Simulation of Dendrite Growth by Cellular Automaton Method

2007 ◽  
Vol 26-28 ◽  
pp. 957-962 ◽  
Author(s):  
Bo Wei Shan ◽  
Xin Lin ◽  
Lei Wei ◽  
Wei Dong Huang
Keyword(s):  
Cellular Automaton ◽  
Growth Kinetics ◽  
Solute Concentration ◽  
Dendrite Growth ◽  
Liquid Interface ◽  
Interface Temperature ◽  
Algebraic Equations ◽  
Interface Growth ◽  
Solid Liquid Interface ◽  
Solid Liquid

A modified cellular automaton model was proposed to simulate the dendrite growth of alloy. Different from previous models, this model used neither an analytical equation(such as KGT model) nor an interface solute gradient equation to solve the velocity of solid-liquid interface, but used the interface solute and energy conservation and thermodynamic equilibrium condition to describe the solid/liquid interface growth kinetics process. In present model, once the temperature field and solute field were solved by finite different method in the entire domain, the material thermodynamic properties can be substituted into four algebraic equations to easily determine the variation of solid fraction, interface temperature and solute concentration, instead of calculating interface moving velocity. As a result, the complexity of the calculation can be largely reduced. The simulated dendrite growth was in a good agreement with the Lipton–Glicksman–Kurz (LGK) model for free dendritic growth in undercooled melts.

Adsorption Kinetics of Polyvinyl Acetate Adsorbed at the Solid-Liquid Interface

1991 ◽  
Vol 248 ◽  
Author(s):  
H. Terashima ◽  
K. Kanehashi ◽  
N. Imai
Keyword(s):  
Slow Rate ◽  
Polyvinyl Acetate ◽  
Adsorption Equilibrium ◽  
Initial Rate ◽  
Unit Area ◽  
Liquid Interface ◽  
Kinetics Of Adsorption ◽  
Solid Liquid Interface ◽  
Solid Liquid ◽  
Kinetics Of

AbstractThe kinetics of adsorption of polyvinyl acetate at the solid-liquid interface has been studied to verify the correctness of a description in a paper [Peterson and Kwel, J.Phys.Chem. 65, 1330(1961)] : “the initial rate of adsorption of polyvinyl acetate was found to be rapid”. This is inconsistent with the widely accepted knowledge that polymer adsorption is a slow process. Polyvinyl acetate (Mw = 124,800) was adsorbed from benzene (0.001 to 0.05 mg ml−1) onto mica at 295.5 K. The adsorbed amount per unit area i.e. adsorbance has been determined as a function of incubation time using an ultramicrobalance [Mettler UM3]. The results obtained show that the adsorbance rises rapidly at the beginning of adsorption and then reaches an apparent plateau, where the adsorbance still increases at negligibly slow rate in comparison with the initial rate. The Peterson and Kwei's results have been confirmed to be correct. We regarded the plateau as an adsorption equilibrium and constructed adsorption isotherms, in which the Peterson and Kwei's results were incorporated. These isotherms are found to be less dependent on concentration in the dilute region concerned. This dependency is in agreement with the prediction of the Scheutjens and Fleer theory based on the loop-train-tail model.

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