Local Atomic Order in the Melt and Solid-Liquid Interface Effect on the Growth Kinetics in a Metallic Alloy Model

2013 ◽  
Vol 110 (8) ◽  
Author(s):  
M. Guerdane ◽  
H. Teichler ◽  
B. Nestler
Keyword(s):  
Growth Kinetics ◽  
Liquid Interface ◽  
Metallic Alloy ◽  
Interface Effect ◽  
Atomic Order ◽  
Solid Liquid Interface ◽  
Solid Liquid

A New Growth Kinetics in Simulation of Dendrite Growth by Cellular Automaton Method

2007 ◽  
Vol 26-28 ◽  
pp. 957-962 ◽  
Author(s):  
Bo Wei Shan ◽  
Xin Lin ◽  
Lei Wei ◽  
Wei Dong Huang
Keyword(s):  
Cellular Automaton ◽  
Growth Kinetics ◽  
Solute Concentration ◽  
Dendrite Growth ◽  
Liquid Interface ◽  
Interface Temperature ◽  
Algebraic Equations ◽  
Interface Growth ◽  
Solid Liquid Interface ◽  
Solid Liquid

A modified cellular automaton model was proposed to simulate the dendrite growth of alloy. Different from previous models, this model used neither an analytical equation(such as KGT model) nor an interface solute gradient equation to solve the velocity of solid-liquid interface, but used the interface solute and energy conservation and thermodynamic equilibrium condition to describe the solid/liquid interface growth kinetics process. In present model, once the temperature field and solute field were solved by finite different method in the entire domain, the material thermodynamic properties can be substituted into four algebraic equations to easily determine the variation of solid fraction, interface temperature and solute concentration, instead of calculating interface moving velocity. As a result, the complexity of the calculation can be largely reduced. The simulated dendrite growth was in a good agreement with the Lipton–Glicksman–Kurz (LGK) model for free dendritic growth in undercooled melts.

Supramolecular Self‐Assembly and Organization of Collagen at Solid/Liquid Interface: Effect of Spheroid‐ and Rod‐Shaped TiO 2 Nanocrystals

2019 ◽  
Vol 6 (14) ◽  
pp. 1900195 ◽  
Author(s):  
Mathieu Beauvais ◽  
Thomas Degabriel ◽  
Nesrine Aissaoui ◽  
Vincent Dupres ◽  
Elodie Colaço ◽  
...  
Keyword(s):  
Self Assembly ◽  
Liquid Interface ◽  
Interface Effect ◽  
Solid Liquid Interface ◽  
Solid Liquid

Growth kinetics of intermediate compounds at a planar solid-solid or solid-liquid interface by diffusion mechanisms

1997 ◽  
Vol 82 (12) ◽  
pp. 6001-6007 ◽  
Author(s):  
André Coulet ◽  
Karine Bouche ◽  
Francis Marinelli ◽  
Francoise Barbier
Keyword(s):  
Growth Kinetics ◽  
Liquid Interface ◽  
Diffusion Mechanisms ◽  
Solid Liquid Interface ◽  
Solid Liquid ◽  
Kinetics Of

Growth kinetics of IMC at the solid Cu/liquid Sn interface

2018 ◽  
Vol 30 (3) ◽  
pp. 145-152
Author(s):  
Zuozhu Yin ◽  
Fenglian Sun ◽  
Yang Liu ◽  
Yang Liu
Keyword(s):  
Mathematical Model ◽  
Growth Kinetics ◽  
Growth Index ◽  
Optical Microscope ◽  
Liquid Interface ◽  
Grain Coarsening ◽  
Content Type ◽  
Solid Liquid Interface ◽  
Solid Liquid ◽  
Kinetics Of

Purpose The purpose of this paper is to investigate growth kinetics of interfacial Cu-Sn intermetallic compound (IMC) at the solid Cu/liquid Sn interface. Design/methodology/approach The Sn/Cu solid–liquid interfacial IMCs are fabricated under various soldering temperatures (240°C-270°C) and soldering times (5-240 s) by dipping method. The thickness and morphology of IMC are observed and analyzed by the optical microscope and scanning electron microscope. Findings Holding at 260°C, Cu/Sn solid–liquid interface Cu6Sn5 growth index experience a change from 0.08 to 0.30 within 10-190 s. The growth index is 0.08 in 10-40 s; the growth index is 0.30 in 40-190 s. Cu6Sn5 grain coarsening index is constant within 10-190 s. It is 0.13. The result of the index of Cu6Sn5 grain coarsening is different from predecessors 27 results Cu6Sn5 grain coarsening index for 1/3. This is because Cu6Sn5 grain grows at the expense of its near small grain to reduce the surface Gibbs free energy, and its morphology changes from regular shape to irregular shape. It sets up the mathematical expression about the initial formation time and temperature of Cu3Sn in 240°C-270°C. Originality/value It obtains a mathematical model to express the changes of solid–liquid interface frontier concentration which has an effect on the interfacial Cu6Sn5 layer growth index and the Cu6Sn5 grain coarsening index. Different indexes can be obtained by establishing relevance equations, which can be used to predict the growth of the interface IMC layer. This mathematical model is established to design the solder pads and the sizes of the solder joints.

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