Thermal stress induced void formation during 450 mm defect free silicon crystal growth and implications for wafer inspection
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2018 ◽
Vol 355
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pp. 012005
2019 ◽
Vol 65
(1)
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pp. 36-46
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2001 ◽
Vol 231
(4)
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pp. 442-447
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2012 ◽
Vol 360
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pp. 43-46
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