Thermal stress induced void formation during 450 mm defect free silicon crystal growth and implications for wafer inspection

2013 ◽  
Vol 102 (8) ◽  
pp. 082108 ◽  
Author(s):  
E. Kamiyama ◽  
J. Vanhellemont ◽  
K. Sueoka ◽  
K. Araki ◽  
K. Izunome
2001 ◽  
Vol 231 (4) ◽  
pp. 442-447 ◽  
Author(s):  
Zhihong Wang ◽  
Robert A. Brown

2013 ◽  
Vol 20 (2) ◽  
pp. 224-226 ◽  
Author(s):  
Ya-Cheng Liu ◽  
Hsin-Yi Tsai ◽  
Min-Wei Hung ◽  
Kuo-Cheng Huang

2012 ◽  
Vol 360 ◽  
pp. 43-46 ◽  
Author(s):  
H.-J. Rost ◽  
R. Menzel ◽  
A. Luedge ◽  
H. Riemann

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