Multi-scale simulation flow and multi-scale materials characterization for stress management in 3D through-silicon-via integration technologies – Effect of stress on 3D IC interconnect reliability

2014 ◽  
Author(s):  
Valeriy Sukharev ◽  
Ehrenfried Zschech
Keyword(s):  
Stress Management ◽  
Materials Characterization ◽  
3D Ic ◽  
Through Silicon Via ◽  
Multi Scale ◽  
Interconnect Reliability

Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV)

2011 ◽  
Vol 2011 (1) ◽  
pp. 000025-000032 ◽  
Author(s):  
Heng-Chieh Chien ◽  
John H. Lau ◽  
Yu-Lin Chao ◽  
Ra-Min Tain ◽  
Ming-Ji Dai ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Thermal Behavior ◽  
Thermal Performance ◽  
Equivalent Thermal Conductivity ◽  
3D Ic ◽  
Through Silicon Via

Thermal performance of 3D IC integration is investigated in this study. Emphasis is placed on the determination of a set of equivalent thermal conductivity equations for Cu-filled TSVs with various TSV diameters, TSV pitches, TSV thicknesses, passivation thicknesses, and microbump pads. Also, the thermal behavior of a TSV cell is examined. Furthermore, 3D heat transfer simulations are adopted to verify the accuracy of the equivalent equations. Finally, the feasibility of these equivalent equations is demonstrated through a simple 3D IC integration structure.

Elastic anisotropy of Cu and its impact on stress management for 3D IC: Nanoindentation and TCAD simulation study

2011 ◽  
Vol 27 (1) ◽  
pp. 339-348 ◽  
Author(s):  
Kong Boon Yeap ◽  
Ehrenfried Zschech ◽  
Ude D. Hangen ◽  
Thomas Wyrobek ◽  
Lay Wai Kong ◽  
...  
Keyword(s):  
Stress Management ◽  
Simulation Study ◽  
Elastic Anisotropy ◽  
3D Ic ◽  
Tcad Simulation ◽  
Image Position

Abstract

Heat dissipation assessment of through silicon via (TSV)-based 3D IC packaging for CMOS image sensing

2016 ◽  
Vol 59 ◽  
pp. 84-94 ◽  
Author(s):  
Hsien-Chie Cheng ◽  
Tzu-Chin Huang ◽  
Po-Wen Hwang ◽  
Wen-Hwa Chen
Keyword(s):  
Heat Dissipation ◽  
3D Ic ◽  
Through Silicon Via ◽  
Image Sensing ◽  
3D Ic Packaging ◽  
Ic Packaging

Modeling and analysis of differential signal Through Silicon Via (TSV) in 3D IC

2010 ◽  
Author(s):  
Joohee Kim ◽  
Jun So Pak ◽  
Jonghyun Cho ◽  
Junho Lee ◽  
Hyungdong Lee ◽  
...  
Keyword(s):  
3D Ic ◽  
Through Silicon Via ◽  
Differential Signal ◽  
Modeling And Analysis

Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV)

2012 ◽  
Vol 9 (2) ◽  
pp. 97-103 ◽  
Author(s):  
Heng-Chieh Chien ◽  
John H. Lau ◽  
Yu-Lin Chao ◽  
Ra-Min Tain ◽  
Ming-Ji Dai ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Thermal Behavior ◽  
Thermal Performance ◽  
Equivalent Thermal Conductivity ◽  
3D Ic ◽  
Through Silicon Via

Thermal performance of 3D IC integration is investigated in this study. Emphasis is placed on the determination of a set of equivalent thermal conductivity equations for Cu-filled TSVs with various TSV diameters, TSV pitches, TSV thicknesses, passivation thicknesses, and microbump pads. Also, the thermal behavior of a TSV cell is examined. Furthermore, 3D heat transfer simulations are adopted to verify the accuracy of the equivalent equations. Finally, the feasibility of these equivalent equations is demonstrated through a simple 3D IC integration structure.

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