Floorplanning for 3D-IC with Through-Silicon via co-design using simulated annealing

2018 ◽  
Author(s):  
Hai-Ying Zhu ◽  
Mu-Shui Zhang ◽  
Yi-Fei He ◽  
Yue-Hui Huang
Keyword(s):  
Simulated Annealing ◽  
3D Ic ◽  
Through Silicon Via

Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV)

2011 ◽  
Vol 2011 (1) ◽  
pp. 000025-000032 ◽  
Author(s):  
Heng-Chieh Chien ◽  
John H. Lau ◽  
Yu-Lin Chao ◽  
Ra-Min Tain ◽  
Ming-Ji Dai ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Thermal Behavior ◽  
Thermal Performance ◽  
Equivalent Thermal Conductivity ◽  
3D Ic ◽  
Through Silicon Via

Thermal performance of 3D IC integration is investigated in this study. Emphasis is placed on the determination of a set of equivalent thermal conductivity equations for Cu-filled TSVs with various TSV diameters, TSV pitches, TSV thicknesses, passivation thicknesses, and microbump pads. Also, the thermal behavior of a TSV cell is examined. Furthermore, 3D heat transfer simulations are adopted to verify the accuracy of the equivalent equations. Finally, the feasibility of these equivalent equations is demonstrated through a simple 3D IC integration structure.

Heat dissipation assessment of through silicon via (TSV)-based 3D IC packaging for CMOS image sensing

2016 ◽  
Vol 59 ◽  
pp. 84-94 ◽  
Author(s):  
Hsien-Chie Cheng ◽  
Tzu-Chin Huang ◽  
Po-Wen Hwang ◽  
Wen-Hwa Chen
Keyword(s):  
Heat Dissipation ◽  
3D Ic ◽  
Through Silicon Via ◽  
Image Sensing ◽  
3D Ic Packaging ◽  
Ic Packaging

Modeling and analysis of differential signal Through Silicon Via (TSV) in 3D IC

2010 ◽  
Author(s):  
Joohee Kim ◽  
Jun So Pak ◽  
Jonghyun Cho ◽  
Junho Lee ◽  
Hyungdong Lee ◽  
...  
Keyword(s):  
3D Ic ◽  
Through Silicon Via ◽  
Differential Signal ◽  
Modeling And Analysis

Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV)

2012 ◽  
Vol 9 (2) ◽  
pp. 97-103 ◽  
Author(s):  
Heng-Chieh Chien ◽  
John H. Lau ◽  
Yu-Lin Chao ◽  
Ra-Min Tain ◽  
Ming-Ji Dai ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Thermal Behavior ◽  
Thermal Performance ◽  
Equivalent Thermal Conductivity ◽  
3D Ic ◽  
Through Silicon Via

Thermal performance of 3D IC integration is investigated in this study. Emphasis is placed on the determination of a set of equivalent thermal conductivity equations for Cu-filled TSVs with various TSV diameters, TSV pitches, TSV thicknesses, passivation thicknesses, and microbump pads. Also, the thermal behavior of a TSV cell is examined. Furthermore, 3D heat transfer simulations are adopted to verify the accuracy of the equivalent equations. Finally, the feasibility of these equivalent equations is demonstrated through a simple 3D IC integration structure.

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