The role of edge current density on kink mode stability and its implication for magnetohydrodynamic activity associated with edge localized modes

1992 ◽  
Vol 4 (7) ◽  
pp. 1901-1908 ◽  
Author(s):  
Janardhan Manickam
1994 ◽  
Author(s):  
J.R. Ferron ◽  
L.L. Lao ◽  
T.H. Osborne ◽  
E.J. Strait ◽  
T.S. Taylor ◽  
...  

2017 ◽  
Vol 24 (6) ◽  
pp. 062503 ◽  
Author(s):  
L. Bardóczi ◽  
T. L. Rhodes ◽  
T. A. Carter ◽  
R. J. La Haye ◽  
A. Bañón Navarro ◽  
...  

Author(s):  
Viktor Bulanin ◽  
Gleb Kurskiev ◽  
Vladimir Solokha ◽  
Alexander Yashin ◽  
Nikita Sergeevich Zhiltsov

Abstract A new model for interaction between the internal reconnections caused by sawtooth and the edge-localized modes (ELM) was presented. The experimental evidence of the coupling between sawtooth crash and ELM events were observed in the Globus-M and Globus-M2 tokamaks. The numerical analysis of magnetic equilibrium showed that internal reconnections can induce the excess current density near the separatrix during the several hundreds of μs. The excess current destabilizes the peeling-ballooning instability. The peeling-ballooning stability analysis showed that the penetration depth of the induced current should be in the range of ψnorm = 0.8 - 0.95 to trigger the instability.


2013 ◽  
Vol 53 (7) ◽  
pp. 073005 ◽  
Author(s):  
I.G.J. Classen ◽  
J.E. Boom ◽  
A.V. Bogomolov ◽  
E. Wolfrum ◽  
M. Maraschek ◽  
...  

Author(s):  
J. R. Michael ◽  
A. D. Romig ◽  
D. R. Frear

Al with additions of Cu is commonly used as the conductor metallizations for integrated circuits, the Cu being added since it improves resistance to electromigration failure. As linewidths decrease to submicrometer dimensions, the current density carried by the interconnect increases dramatically and the probability of electromigration failure increases. To increase the robustness of the interconnect lines to this failure mode, an understanding of the mechanism by which Cu improves resistance to electromigration is needed. A number of theories have been proposed to account for role of Cu on electromigration behavior and many of the theories are dependent of the elemental Cu distribution in the interconnect line. However, there is an incomplete understanding of the distribution of Cu within the Al interconnect as a function of thermal history. In order to understand the role of Cu in reducing electromigration failures better, it is important to characterize the Cu distribution within the microstructure of the Al-Cu metallization.


Author(s):  
Huan Jin ◽  
Wu Yu ◽  
Feng Long ◽  
Min Yu ◽  
Qiyang Han ◽  
...  

The design and R&D for ITER In-Vessel Coils (IVCs) is being deployed. The concerned issue of “Edge Localized Modes” (ELMs) and “Vertical Stabilization” (VS) of the ITER plasma can be addressed by the implemented IVCs. The ELM and VS coils will be installed in the vessel just behind the blanket shield modules to reach the requirement of keeping strong coupling with the plasma. The 59mm Stainless Steel Jacketed Mineral Insulated Conductor (SSMIC) using MgO as the insulation is being designed for the IVCs to resist the special challenges, including the nuclear radiation, high temperature, electromagnetic and thermal fatigue. It is necessary to take the mechanical performances of the SSMIC and the feasibility of fabrication techniques into consideration of the R&D program. The mechanical performances of the SSMIC close to the actual work conditions, including the three point bend modulus, three point bend cyclical performance and the cyclical performance with a U-bend sample of the SSMIC prototypes have been investigated and the results are presented in this paper.


2009 ◽  
Vol 49 (4) ◽  
pp. 049801
Author(s):  
G.Y Antar ◽  
S.I Krasheninnikov ◽  
P.B Snyder ◽  
R.A Moyer ◽  
R Pugno ◽  
...  

2011 ◽  
Vol 53 (9) ◽  
pp. 095008 ◽  
Author(s):  
A Kirk ◽  
H W Muller ◽  
E Wolfrum ◽  
H Meyer ◽  
A Herrmann ◽  
...  

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