ABSTRACTThe temperature dependent competition between solid phase epitaxy and random
crystallization in ion-implanted (As+, B+,
F+, and BF2+) silicon films is investigated. Measurements of time-resolved
reflectivity during cw laser heating show that in the As+,
F+, and BF2+-implanted layers (conc 4×1020cm-3)
epitaxial growth is disrupted at temperatures 1000°C. This effect is not
observed in intrinsic films or in the B+-implanted layers.
Correlation with results of microstructural analyses and computer simulation
of the reflectivity experiment indicates that disruption of epitaxy is
caused by enhancement of the random crystallization rate by arsenic and
fluorine. Kinetics parameters for the enhanced crystallization process are
determined; results are interpreted in terms of impurity-catalyzed
nucleation during the random crystallization process.