Anomalous anti-Stokes Scattering in Amorphous Carbon Thin Films

This work is devoted to a study of temperature-dependent Raman scattering of amorphous carbon (a-C) thin films. An anomalous rise of the anti-Stokes intensity in respect to the Stokes intensity was observed. This result comes from the resonant enhancement of anti-Stokes scattering of defects of graphite-like crystals. The observed discrepancy is quantified through a coefficient, a, defined as a ratio of the anti-Stokes and Stokes scattering cross sections. Understanding the mechanism for anomalous enhancement of anti-Stokes scattering provides a way for correct probing the temperature of the a-C thin films exposed to cw laser illumination.

Optical Heating Controlled With a Thermoplasmonic Metasurface

We develop a photothermal technology to control optical heating of polymer and liquid crystal films through a refractory titanium nitride (TiN) metasurface. The metasurface represents an array of identical square-shaped TiN nanoantennas on a Si substrate. Upon CW laser illumination, a TiN nanoantenna experiences anomalous Joule heating at a plasmon resonance. A temperature rise provides a unique opportunity for locally probing phase transitions. In the case of heterogeneous PMMA thin films or polymeric blends, a controlled optical heating is needed to probe the glass transition temperature (Tg) of their constituents. Here, we model a controlled thermal response originating from the TiN nanoantenna under CW laser illumination by using FDTD/FEM methods.

Dual Laser Beam Asynchronous Dicing of 4H-SiC Wafer

SiC wafers, due to their hardness and brittleness, suffer from a low feed rate and a high failure rate during the dicing process. In this study, a novel dual laser beam asynchronous dicing method (DBAD) is proposed to improve the cutting quality of SiC wafers, where a pulsed laser is firstly used to introduce several layers of micro-cracks inside the wafer, along the designed dicing line, then a continuous wave (CW) laser is used to generate thermal stress around cracks, and, finally, the wafer is separated. A finite-element (FE) model was applied to analyze the behavior of CW laser heating and the evolution of the thermal stress field. Through experiments, SiC samples, with a thickness of 200 μm, were cut and analyzed, and the effect of the changing of continuous laser power on the DBAD system was also studied. According to the simulation and experiment results, the effectiveness of the DBAD method is certified. There is no more edge breakage because of the absence of the mechanical breaking process compared with traditional stealth dicing. The novel method can be adapted to the cutting of hard-brittle materials. Specifically for materials thinner than 200 μm, the breaking process in the traditional SiC dicing process can be omitted. It is indicated that the dual laser beam asynchronous dicing method has a great engineering potential for future SiC wafer dicing applications.

Investigation of the Effect of Temperature Stabilization in Radiation–Heat Converters Based on a Strong Absorbing Coating

Light–heat converters are promising for further development of contact laser surgery. The simplest converter consists of an optical fiber with a strong absorbing layer at the tip. We studied the time dependence of the tip temperature at different CW laser powers and revealed that, in several seconds, the temperature evolution becomes almost power-independent. Mathematical modeling showed that laser ablation of the tip coating is the main reason for this phenomenon.