Heat Transfer Enhancement in a Microchannel Heat Sink: Nanofluids and/or Micro Pin Fins

2019 ◽  
Vol 41 (21) ◽  
pp. 1818-1828 ◽  
Author(s):  
Turgay Coşkun ◽  
Erdal Çetkin
Author(s):  
Ihsan Ali Ghani ◽  
Nor Azwadi Che Sidik ◽  
Rizal Mamat ◽  
G. Najafi ◽  
Tan Lit Ken ◽  
...  

1999 ◽  
Vol 121 (4) ◽  
pp. 972-977 ◽  
Author(s):  
F.-C. Chou ◽  
J. R. Lukes ◽  
C.-L. Tien

The current literature contains many studies of microchannel and micro-pin-fin heat exchangers, but none of them consider the size effect on the thermal conductivity of channel and fin walls. The present study analyzes the effect of size (i.e., the microscale effect) on the microfin performance, particularly in the cryogenic regime where the microscale effect is often appreciable. The size effect reduces the thermal conductivity of microchannel and microfin walls and thus reduces the heat transfer rate. For this reason, heat transfer enhancement by microfins becomes even more important than for macroscale fins. The need for better understanding of heat transfer enhancement by microfins motivates the current study, which resolves three basic issues. First, it is found that the heat, flow choking can occur even in the case of simple plate fins or pin fins in the microscale regime, although choking is usually caused by the accommodation of a cluster of fins at the fin tip. Second, this paper shows that the use of micro-plate-fin arrays yields a higher heat transfer enhancement ratio than the use of the micro-pin-fin arrays due to the stronger reduction of thermal conductivity in micro-pin-fins. The third issue is how the size effect influences the fin thickness optimization. For convenience in design applications, an equation for the optimum fin thickness is established which generalizes the case without the size effect as first reported by Tuckerman and Pease.


2012 ◽  
Vol 134 (10) ◽  
Author(s):  
Y. J. Lee ◽  
P. S. Lee ◽  
S. K. Chou

Sectional oblique fins are employed, in contrast to continuous fins in order to modulate the flow in microchannel heat sinks. The breakage of a continuous fin into oblique sections leads to the reinitialization of the thermal boundary layer at the leading edge of each oblique fin, effectively reducing the boundary layer thickness. This regeneration of entrance effects causes the flow to always be in a developing state, thus resulting in better heat transfer. In addition, the presence of smaller oblique channels diverts a small fraction of the flow into adjacent main channels. The secondary flows created improve fluid mixing, which serves to further enhance heat transfer. Both numerical simulations and experimental investigations of copper-based oblique finned microchannel heat sinks demonstrated that a highly augmented and uniform heat transfer performance, relative to the conventional microchannel, is achievable with such a passive technique. The average Nusselt number, Nuave, for the copper microchannel heat sink which uses water as the working fluid can increase as much as 103%, from 11.3 to 22.9. Besides, the augmented convective heat transfer leads to a reduction in maximum temperature rise by 12.6 °C. The associated pressure drop penalty is much smaller than the achieved heat transfer enhancement, rendering it as an effective heat transfer enhancement scheme for a single-phase microchannel heat sink.


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