Statistical analysis of accelerated temperature cycling test based on Coffin-Manson model

2019 ◽  
Vol 49 (15) ◽  
pp. 3663-3680
Author(s):  
Yudong Wang ◽  
Yincai Tang
Keyword(s):  
Statistical Analysis ◽  
Temperature Cycling ◽  
Cycling Test ◽  
Temperature Cycling Test

Temperature Characteristics of Li-Ion Batteries

2014 ◽  
Vol 1008-1009 ◽  
pp. 274-276
Author(s):  
Hong Wei Wang ◽  
Zi Qiang Tao ◽  
Yan Ling Fu ◽  
Hong Bai ◽  
Hai Qing Xiao
Keyword(s):  
Temperature Cycling ◽  
Safety Performance ◽  
Quality And Safety ◽  
Li Ion Batteries ◽  
Temperature Characteristics ◽  
Cycling Test ◽  
Li Ion ◽  
Temperature Cycling Test

Two kinds of import laptop battery and one kind of domestic laptop battery were investigated in the temperature cycling test. The results showed that all the samples didn’t fire, explosion and leakage in the temperature cycling tests. But the shell glue of domestic laptop battery was disabled more serious then that of import laptop battery and it still exist some security risk.Therefore, There is a long way to go to investigate and improve the quality and safety performance of some laptop battery.

Fiber alignment shift in temperature cycling test

1998 ◽  
Author(s):  
Yih-Cheng Sheu ◽  
Cheng-Huang Chen ◽  
Chy-Pen Chien ◽  
Jao-Hwa Kuang ◽  
Wood-Hi Cheng ◽  
...  
Keyword(s):  
Temperature Cycling ◽  
Fiber Alignment ◽  
Cycling Test ◽  
Temperature Cycling Test

Can Power Cycling Life of Solder Joint Interconnections be Assessed on the Basis of Temperature Cycling Tests?

1989 ◽  
Vol 111 (4) ◽  
pp. 310-312 ◽  
Author(s):  
E. Suhir
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Temperature Cycling ◽  
Cycling Test ◽  
Test Conditions ◽  
Power Cycling ◽  
Temperature Cycling Test ◽  
Cycling Life

We discuss how temperature cycling test conditions could be modified to be used for a tentative evaluation of the fatigue life of solder joint interconnections in surface mounted devices subjected to power cycling.

FCCSP IMC Growth under Reliability Stress follow Automotive Criteria

2018 ◽  
Vol 2018 (1) ◽  
pp. 000129-000134
Author(s):  
Wei-Wei Liu (Xenia) ◽  
Berdy Weng ◽  
Jerry Li ◽  
CK Yeh
Keyword(s):  
Stress Test ◽  
Temperature Cycling ◽  
Cycling Test ◽  
Slowing Down ◽  
Large Numbers ◽  
Initial Stage ◽  
Cu3sn Layer ◽  
Temperature Cycling Test ◽  
Semiconductor Interconnects

Abstract The kirkendall void had been a well-known issue for long term reliability of semiconductor interconnects, while even the KVs existing at the interfaces of Cu & Sn, it may still be able to pass the condition of un-bias long term reliability testing, especially for 2,000 cycles of temperature cycling test and 2,000hrs of high temperature storage. A large numbers of KVs was observed after 200cycles of temperature cycling test at the intermetallic Cu3Sn layer which locate between the intermetallic Cu6Sn5 & Cu layers. These kinds of voids will growth proportional with the aging time at initial stage, but slowing down attribute to the barrier layer of Cu3Sn & Cu interfaces. This paper compare various IMC thickness as a function of stress test, the Cu3Sn & Cu6Sn5 do affected seriously by heat, but Ni3Sn4 is not affected by heat or moisture.

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