Dynamic pull-in and snap-through behavior of electrostatically actuated micro-mechanical memories considering thermoelastic damping

2018 ◽  
Vol 26 (23) ◽  
pp. 1911-1919 ◽  
Author(s):  
Niloofar Ghiathinejad ◽  
Mahdi Moghimi Zand ◽  
Mojtaba Haghighi-Yazdi ◽  
Roozbeh Dargazany
2008 ◽  
Vol 1139 ◽  
Author(s):  
Sairam Prabhakar ◽  
Frederic Nabki ◽  
Mourad El-Gamal ◽  
Srikar Vengallatore

AbstractThe design of microresonators with high natural frequencies (1 MHz to 1 GHz) and low structural damping is essential for devices used for applications in communications. Here, we report experimental measurements of damping at low pressure and ambient temperature in electrostatically-actuated, metallized silicon carbide microresonators. Comparison of the measured values with the predictions of a model for thermoelastic damping indicates that the contribution of this mechanism to the measured damping ranges from 10% to 50% over a broad frequency range (3 MHz to 30 MHz).


Mathematics ◽  
2020 ◽  
Vol 8 (7) ◽  
pp. 1124
Author(s):  
Florina Serdean ◽  
Marius Pustan ◽  
Cristian Dudescu ◽  
Corina Birleanu ◽  
Mihai Serdean

An important aspect that must be considered when designing micro-electro-mechanical systems (MEMS) for all domains, including robotics, is the thermoelastic damping which occurs when the MEMS material is subjected to cyclic stress. This paper is focused on a model for the thermoelastic damping developed based on the generalized thermoelastic theory with the non-Fourier thermal conduction equation. The model was implemented in MATLAB and several simulations were performed. The theoretical results show a decrease in the deflection amplitude with the increase in time. The deflection amplitude decrease was validated by the experimental investigations, consisting of measuring the loss in amplitude and velocity of oscillations as a function of time. Moreover, this paper also presents the influence of the geometric dimensions on the mentioned decrease, as well as on the initial and final values of the amplitude for several polysilicon resonators investigated in this paper.


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