There are various specimen configurations available in the literature for characterizing the mechanical behavior of solder interconnect materials. An ideal test specimen should use a simple geometry to minimize the complexity of the stress analysis and which produces a uniform material response throughout the test material. In the thermo-mechanical micro scale (TMM) test used in this study, we use a simple, notched shear specimen, based on a concept originally proposed by Iosipescu [1967] [1], which produces a very uniform shear stress field in the solder joint volume [Reinikainen et al., 1998] [2]. Our modified Iosipescu specimen comprises of two oxygen free, high conductivity (OFHC) copper platens soldered together and loaded in simple shear. The solder joint in this specimen is only 180 microns wide to capture the length scale effects of functional solder interconnects. This study examines the effects of dimensional variabilities of this modified Iosipescu specimen on the shear stress distribution in the solder joint. Variabilities encountered in these specimens include: (i) fillets at the V-notches, caused by excess solder; (ii) offset between the two copper platens along the loading direction; (iii) taper of the solder joint due to lack of parallelism of the edges of the copper platens; and (iv) misalignment between the specimen centerline and loading axis of the TMM test frame due to mounting variability. Detailed parametric studies of these four dimensional variations in the TMM specimen are conducted using a simple two-dimensional elastic-plastic finite element model. The uniformity of the shear stress field in the specimen is investigated and the variation in the derived stress-strain curves is examined, as a function of the dimensional variabilities described above.
Infrared thermography for shear stress field measurements in flows
