Contact engineering of GaN-on-silicon power devices for breakdown voltage enhancement

2013 ◽  
Vol 28 (7) ◽  
pp. 074018 ◽  
Author(s):  
Yu-Syuan Lin ◽  
Yi-Wei Lian ◽  
Jui-Ming Yang ◽  
Hou-Cheng Lu ◽  
Yen-Chieh Huang ◽  
...  
2011 ◽  
Vol 2-3 ◽  
pp. 1047-1050
Author(s):  
Ey Goo Kang ◽  
Sung Young Hong ◽  
Byoung Sub Ahn

The trench field ring for breakdown voltage of power devices is proposed. The new ring can improve 10% efficiency comparing with conventional field ring. Five parameters of trench field ring for design of trench field ring are analyzed and 2-D devices simulation and process simulations are carried out. The number of field ring, juction depth, distance of field rings, trench width, doping profiled are discussed. The proposed trench field ring was better for higher voltage more than 1000V.


1983 ◽  
Vol 75 (1) ◽  
pp. 207-217 ◽  
Author(s):  
J. P. Gourret ◽  
J. Paille

2016 ◽  
Vol 858 ◽  
pp. 797-802 ◽  
Author(s):  
Anant Agarwal ◽  
Woong Je Sung ◽  
Laura Marlino ◽  
Pawel Gradzki ◽  
John Muth ◽  
...  

The attributes and benefits of wide-bandgap (WBG) semiconductors are rapidly becoming known, as their use in power electronics applications continues to gain industry acceptance. However, hurdles still exist in achieving widespread market acceptance, on a par with traditional silicon power devices. Primary challenges include reducing device costs and the expansion of a workforce trained in their use. The Department of Energy (DOE) is actively fostering development activities to expand application spaces, achieve acceptable cost reduction targets and grow the acceptance of WBG devices to realize DOEs core missions of more efficient energy generation, greenhouse gas reduction and energy security within the U.S. This paper discusses currently funded activities and application areas that are suitable for WBG introduction. A detailed cost roadmap for SiC device introduction is also presented.


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