Intrinsic stress-induced bending as a platform technology for controlled self-assembly of high-Q on-chip RF inductors

2019 ◽  
Vol 29 (6) ◽  
pp. 064002 ◽  
Author(s):  
Rayan Bajwa ◽  
Murat Kaya Yapici
Keyword(s):  
Self Assembly ◽  
Intrinsic Stress ◽  
High Q ◽  
Platform Technology ◽  
On Chip ◽  
Rf Inductors

Silicon on-chip side-coupled high-Q micro-cavities for the multiplexing of high sensitivity photonic crystal integrated sensors array

2016 ◽  
Vol 374 ◽  
pp. 1-7 ◽  
Author(s):  
Daquan Yang ◽  
Chunhong Wang ◽  
Wei Yuan ◽  
Bo Wang ◽  
Yujie Yang ◽  
...  
Keyword(s):  
Photonic Crystal ◽  
High Sensitivity ◽  
Integrated Sensors ◽  
High Q ◽  
Sensors Array ◽  
On Chip

Microfluidic on-chip microwave sensing of the self-assembly state of tubulin

2021 ◽  
Vol 328 ◽  
pp. 129068
Author(s):  
Ondrej Krivosudský ◽  
Daniel Havelka ◽  
Djamel Eddine Chafai ◽  
Michal Cifra
Keyword(s):  
Self Assembly ◽  
The Self ◽  
On Chip

High-$Q$ On-Chip $C$ -Band Inductor With a Nanocrystalline MnZn-Ferrite Film Core

2019 ◽  
Vol 55 (7) ◽  
pp. 1-4 ◽  
Author(s):  
Ranajit Sai ◽  
R. D. Ralandinliu Kahmei ◽  
S. A. Shivashankar ◽  
Masahiro Yamaguchi
Keyword(s):  
Ferrite Film ◽  
Mnzn Ferrite ◽  
High Q ◽  
On Chip

Ultra fine-pitch TSV technology for ultra-dense high-Q RF inductors

2015 ◽  
Author(s):  
Wolfgang A. Vitale ◽  
Montserrat Fernandez-Bolanos ◽  
Armin Klumpp ◽  
Josef Weber ◽  
Peter Ramm ◽  
...  
Keyword(s):  
High Q ◽  
Fine Pitch ◽  
Rf Inductors
Sign in / Sign up

Export Citation Format

Share Document